Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 152 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis Number: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCCACEM16 BG388 T = -40C/+125C (Air to Air) XCCACEM16 3 3 0 94 1,030 96,816 ®
Jan. 1, 2002 P. 153 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis Number: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: XC9536 XC9572 XC95108 XC95288 XC95288* XC95XXX 4 4 0 280 1,006 281,752 16 16 0 1,119 978 1,094,896 Si Gate CMOS XC95XXX PQFP-100,160, PLCC-44, 84, TQFP-100, BGA-352, HQ208 T = -65C/+150C (Air to Air) T = -55C / +125C (Air to Air) for BGA* 1 1 0 76 1,018 77,368 1 1 2 76 1,101 83,676 F/A 00173(2)-CRCP 2 2 0 66 1,000 66,000 24 24 2 1,617 965 1,559,988 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 P. 209 Combined Starte
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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