Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.36 Reliability Testing Summary High Temperature Operating Life Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: XC2S15 XC2S30 XC2S50 XC2S100 1 0 76 76,532 1,007 203,153 15,809,964 1.91E+08 0.22/0.18um Si Gate CMOS XC2SXXX PQFP-208, 240 145C 0.70 ev 60% 1 0 76 35,720 470 94,818 7,379,030 8.92E+07 2 0 152 154,736 1,018 410,744 31,965,329 3.86E+08 2 0 152 91,428 602 242,694 18,887,176 2.28E+08 ®
Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.37 Reliability Testing Summary High Temperature Operating Life Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: 0.22/0.18um Si Gate CMOS XC2SXXX PQFP-208, 240 145C 0.70 ev 60% XC2S150 XC2S200 XC2SXXX 9 0 493 418,945 850 1,112,083 86,545,567 1.05E+09 1 0 76 57,836 761 153,525 11,947,748 1.44E+08 Failure Rate (60% C.L.) in FITS @ Tj=55C: Failure Rate (60% C.L.) in FITS @ Tj=25C: 16 0 1,025 815,361 795 2,164,364 168,437,098 2.04E+09 5 1 ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22: Combined Lots: Failures: Device on
Page 35: Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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