Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 166 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Failure Analysis Number: Reliability Testing Summary-Packages Data Retention Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC95XXXXL PQFP-208, PLCC-44 150C XC9536XL XC9572XL XC95288XL XC95XXXXL 2 2 0 183 1,139 208,400 1 0 0 76 2,010 152,760 2 2 0 98 2,008 196,760 5 5 0 357 1,563 557,920 ®
Jan. 1, 2002 P. 167 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Reliability Testing Summary-Packages Erase Cycling Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC18VXX PLCC- 44 85C XC18V04 XC18VXX 1 1 0 60 10,000 600,000 1 1 0 60 10,000 600,000 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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