Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P.102 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Failure Analysis: Reliability Testing Summary-Packages Hast Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCRXXXX Microcircuit Group BGA492, PC84, CP56 T = 130C, R.H. = 85%, XCR3960 XCR3(5)128 XCR3064A XCRXXX 3 3 0 105 96 10,080 1 1 1 77 96 7,392 1F- single bit charge loss 1 1 0 44 100 4,400 5 5 1 226 97 21,872 ®
Jan. 1, 2002 P.103 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Failure Analysis: Reliability Testing Summary-Packages Hast Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCRXXXXXL Microcircuit Group VQFP-44 T = 130C, R.H. = 85%, XCR3032XL XCRXXXXL 1 1 0 76 100 7,600 1 1 0 76 100 7,600 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 P.49 Combined Started
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Combined Started Lot: Combined Comp
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Jan. 1, 2002 P. 173 Reliability Tes
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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