Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 188 Reliability Testing Summary Package Qualification / Monitor BGA-352 Device Type: Package Type: Die Attach Material: XC4036XL,XC4028XLA,XCV300, XCV150, XC95288 BGA-432 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot Salt Atmosphere Physical Dimension Mark Permanency Note: Test condition for T/C was -55C/+125C 4 1 1 1 1 0 0 0 0 0 156 45 15 5 9 1,001 96 156,180 4,320 ®
Jan. 1, 2002 P. 189 Reliability Testing Summary Package Qualification / Monitor BGA-432 Device Type: Package Type: Die Attach Material: XC4044XL, XC4052XL, XC4062XL/XLA, XC4085XLA, XCV600, XCV300 BGA- 432 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot 85/85 Physical Dimension Ball Shear Bond Pull Mark Permanency Salt Atmosphere Note: Test condition for T/C was -55C/+125C 6 2 2 4 6 6 4 1 0 0 0 0 0 0 0 0 247 90 78 20 30 30 12 15 1,013 96 1,028 250,222 8,640 80,220 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Page 217 and 218: Package Details Motherboard Design
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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