Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 190 Reliability Testing Summary Package Qualification / Monitor BGA-388 Device Type: Package Type: Die Attach Material: XCCACEM16 BGA- 388 N/A Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Note: Test condition for T/C was -40C/+125C 3 0 94 1,030 96,816 ®
Jan. 1, 2002 P. 191 Reliability Testing Summary Package Qualification / Monitor BGA-560 Device Type: Package Type: Die Attach Material: XC4062XLA, XC4085XL/XLA, XCV400, XCV600 XCV800, XCV1000/A, XCV1000E, XCV2000E BGA-560 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot 85/85 Hast Resistance to Solvents Bond Pull Ball Shear Physical Dimension Salt Atmosphere Note: Test condition for T/C was -55C/+125C 16 8 5 1 2 6 6 4 2 0 0 0 0 0 0 0 0 0 475 256 110 22 6 30 30 20 18 1,044 96 1,060 100 496,046 24,576 116,640 2,200 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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