Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Package Motherboard Jan. 1, 2002 P. 220 2nd Level <strong>Reliability</strong> Test - FG680 (SBGA) Package Size I/O Pitch Ball Size – 1.6mm Thick – 0.38mm Pad NSMD Test Data – TC2 is 1.25X More Damaging Cumulative % Failed 99.0 50.0 10.0 5.0 1.0 FG680 1000.0 10000.0 Cycles to Failure β1=22.6, η1=4913.2, ρ=1.0 β2=9.9, η2=4092.2, ρ=1.0 Pad Opening Pad Type Die Size Substrate FG680 (SBGA) 40x40 680 1.0 0.6 0.48 SMD 20.3x20.3x0.3 0.98 Thk, 3 Layer All Dimensions in mm Package Test Condition Cycles Completed # Tested # Failed Weibull TC1 TC2 1st Failure (cycles) Mean Life (cycles) FG680 TC1 5222 29** 20 4219 4796 FG680 TC2 3960 32 16 2883 3891 FG680 TC3 10570 32 0 N/A N/A ®
Package Motherboard Jan. 1, 2002 P. 221 2nd Level <strong>Reliability</strong> Test - FG1156 (PBGA) – 1.6mm Thick – 0.38mm Pad NSMD Test Data Package Size I/O Pitch Ball Size Failures Primarily Underneath the Die Pad Opening Pad Type Die Size Substrate FG1156 (PBGA) 35x35 1156 1.0 0.6 0.48 SMD 23.11x21.13x0.3 0.56 Thk, 4 Layer All Dimensions in mm Package Test Condition Cycles Completed # Tested # Failed 1st Failure (cycles) Mean Life (cycles) FG1156 TC1 3108 32 30 1601 2386 FG1156 TC2 2507 48 32 1666 2256 FG1156 TC3 8824 32 8 7289 9350 FG1156 Cumulative % Failed 99.0 90.0 50.0 10.0 5.0 1.0 1000.0 10000.0 Cycles to Failure β1=8.91, η1=2521.74, ρ=0.99 β2=19.45, η2=2319.62, ρ=0.89 β3=14.88, η3=9684.74, ρ=0.98 Weibull TC1-Die Region W2 RRX -SRM MED F=30 / S=2 TC2-Die Region W2 RRX -SRM MED F=32 / S=16 TC3-Die Region W2 RRX -SRM MED F=6 / S=26 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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