Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.30
Reliability Testing Summary
High Temperature Operating Life
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
0.25um Si Gate CMOS
XC4XXXXL
PLCC-84
145C
0.70 ev
60%
XC4005XL XC4XXXXL
( Dynamic)
1
0
43
152,908
3,556
405,892
31,587,701
3.82E+08
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
1
0
43
152,908
3,556
405,892
31,587,701
3.82E+08
29
2
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