Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Failure Rate(60% C.L.) in FITS @ Tj=55C: Failure Rate(60% C.L.) in FITS @ Tj=25C: Jan. 1, 2002P.22 Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Temperature: Assumed Activation Energy: Si Gate CMOS XCSXXXL, XC2SXXX, XCVXXX Various 145C, 125C 0.70 ev @ C.L. = 60% XCSXXXL XC2SXXX XCVXXX 7 0 298 315,393 1,058 837,206 65,153,817 7.88E+08 14 1 16 0 1,025 815,361 795 2,164,364 168,437,098 2.04E+09 5 1 12 1 488 392,297 804 996,166 77,524,536 9.37E+08 26 2 ®
Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Failure Rate(60% C.L.) in FITS @ Tj=55C: Failure Rate(60% C.L.) in FITS @ Tj=25C: Jan. 1, 2002 P.23 Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Temperature: Assumed Activation Energy: Si Gate CMOS XCVXXX, XCVXXXE, XCVXXXEA, XC2VXXX Various 145C, 125C 0.70 ev @ C.L. = 60% XCVXXX XCVXXXE XCVXXXEA XC2VXXX Dynamic 15 2 642 617,543 962 1,594,078 124,055,806 1.50E+09 25 2 21 2 879 672,407 765 1,409,012 109,653,418 1.33E+09 28 2 4 0 111 92,536 834 190,084 14,792,926 1.79E+08 62 5 13 0 405 411,624 1,016 1,017,639 79,195,628 9.58E+08 12 1 ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
Page 21: Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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