Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
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Combined Lots:<br />
Failures:<br />
Device on test:<br />
Actual device hours:<br />
Mean of Stress Test hour:<br />
Equivalent device hours @ Tj=125C:<br />
Equivalent device hours @ Tj=55C:<br />
Equivalent device hours @ Tj=25C:<br />
Failure Rate (60% C.L.) in FITS @ Tj=55C:<br />
Failure Rate (60% C.L.) in FITS @ Tj=25C:<br />
Jan. 1, 2002 P. 117<br />
<strong>Reliability</strong> Testing Summary<br />
High Temperature Life Test<br />
Qualification & <strong>Monitor</strong> Combined<br />
Technology:<br />
Device Type:<br />
Package Type:<br />
Actual Junction Temperature:<br />
Assumed Activation Energy:<br />
Confidence Level:<br />
Si Gate CMOS<br />
XC17XXXE, XC17XXXL, 17SXX, XC17SXXXL<br />
Various<br />
145C<br />
0.58 ev for Eprom,<br />
60%<br />
XC17XXXE XC17XXL XC17SXX XC17SXXXL<br />
3<br />
0<br />
197<br />
203,230<br />
1,032<br />
456,337<br />
16,834,625<br />
1.33E+08<br />
54<br />
7<br />
1<br />
0<br />
307<br />
244,912<br />
798<br />
549,931<br />
20,287,367<br />
1.60E+08<br />
43<br />
6<br />
10<br />
0<br />
653<br />
744,836<br />
1,141<br />
1,672,471<br />
61,698,738<br />
4.87E+08<br />
15<br />
2<br />
9<br />
0<br />
529<br />
475,685<br />
899<br />
1,068,114<br />
39,403,525<br />
3.11E+08<br />
23<br />
3<br />
®
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