Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 186 Reliability Testing Summary Package Qualification / Monitor HTFP Device Type: Package Type: Die Attach Material: Molding Compound: XC4013XL HT-144 Silver Epoxy 7320CR Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot 85/85 Resistance to Solvents Physical Dimension Lead Integrity Solderability 1 1 1 1 1 1 1 0 0 0 0 0 0 0 44 44 44 3 5 2 3 1,025 96 1,052 45,100 4,224 46,288 ®
Jan. 1, 2002 P. 187 Reliability Testing Summary Package Qualification / Monitor BGA-256 Device Type: Package Type: Die Attach Material: XC4013XL, XC4020XL/XLA, XC4028XLA, XCS40XL BGA-256, Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot Ball Shear Salt Atmosphere Mark Permanency Bond Pull Physical Dimension Note: Test condition for T/C was -55C/+125C 7 1 1 1 2 1 2 0 0 0 0 0 0 0 223 14 1 15 6 1 10 1,027 96 229,126 1,344 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Page 173 and 174: Jan. 1, 2002 P. 173 Reliability Tes
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Page 217 and 218: Package Details Motherboard Design
Page 219 and 220: Package Motherboard Jan. 1, 2002 P
Page 221 and 222: Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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