Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Volume Resistivity (Ohm.cm) 150C Jan. 1, 2002 P. 12 Plastic Encapsulant Data (Typical) Test Conditions 6300HS 7320C 7304 MP8000CH4 Water Absorption ) Boil 48 hrs (wt%) 0.3/24 hrs 0.22/24 hrs 0.25/24 hrs 0.3/48 hrs Spiral Flow (cm) 80 180 125 90cm Ionic Impurities 160C x 23 hrs Extraction Na+ (ppm)
Temperature (C o ) XILINX Typical Convection Oven Reflow Jan. 1, 2002 P. 13 1 1 220 - 225 o C ≅ 10-40 sec max 1 Transition rate 4 - 5 o C/s Preheat and drying dwell 120 s max between 100o - 150o 2 C 2 Dwell is intended for partial dryout 3 Ramp down 1 - 4 o C/s These Guidelines are for reference. It is recommended that actual packages with known loads be checked with the commercial equipment prior to engaging in mass production. 100 200 300 400 500 Time (seconds) Dwell 60-120 s @ >/= 183 o C
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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