Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
P. 154
Combined Started Lot:
Combined Completed Lots:
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Failure Analysis Number:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
Si Gate CMOS
XC95XXXL
PQFP-208, TQFP-144, CS-144-280, VQFP-64, PLCC-44
T = -65C/+150C (Air to Air)
T = -55C / +125C (Air to Air) for CS* & BGA*
XC95144XL XC95144XL* XC95288XL
2
2
0
150
1,000
150,000
1
1
0
41
1,012
41,492
2
2
0
153
1,077
168,840
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