Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 174 Reliability Testing Summary Package Qualification / Monitor SOIC Device Type: Package Type: Die Attach Material: Molding Compound: XC1701, XC17V01, XC18V01, XCR22V10 SOIC-20, 24 Silver Epoxy EME6300H, MP8000-CH4 Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot 85/85 Solderability Lead Fatigue Physical Dimension Resistance to Solvents Bond Pull 4 5 3 1 1 3 2 4 0 0 0 0 0 0 0 0 269 248 164 3 4 15 6 20 867 143 1,084 233,144 35,400 177,827 ®
Jan. 1, 2002 P. 175 Reliability Testing Summary Package Qualification / Monitor TSOP Device Type: Package Type: Die Attach Material: Molding Compound: XC17S20, XC17V01, XCR22V10 VO8, VO24 Silver Epoxy KMC 184-3, MP8000-CH4 Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot 85/85 Solderability Physical Dimension Resistance to Solvents Lead Fatigue Bond Pull 4 4 1 1 3 1 1 2 0 0 0 0 0 0 0 0 272 271 45 3 15 3 3 10 1,031 96 1,004 280,445 26,016 45,180 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Jan. 1, 2002 Combined Started Lot:
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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