Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
P.85
Combined Started Lot:
Combined Completed Lots:
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
XCV50* XCV100 XCV150* XCV200* XCV300 XCV300*
2
2
0
49
1,096
53,710
1
1
0
22
1,038
22,836
Si Gate CMOS
XCVXXX
HQFP-240, PQFP-240
FG-256,456,676,680, BGA-352,432,560
T = -65C/+150C (Air to Air)
*For CS, BGA,FG, T=-55C/+125C (Air to Air)
1
1
0
45
1,000
45,000
4
4
0
218
1,006
219,342
2
2
0
79
1,004
79,315
4
4
0
150
1,008
151,232
®