Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.40 Failure Analysis: Reliability Testing Summary High Temperature Operating Life Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: 0.22 um Si Gate CMOS XCVXXX PQFP-240 145C 0.70 ev 60% XCV300 XCVXXX (Dynamic) 2 0 41 41,000 1,000 108,834 8,469,771 1.02E+08 Failure Rate (60% C.L.) in FITS @ Tj=55C: Failure Rate (60% C.L.) in FITS @ Tj=25C: 2 0 41 41,000 1,000 108,834 8,469,771 1.02E+08 108 9 ®
Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equiv. device hrs @ Tj=125C: Equiv. device hrs @ Tj=55C: Equiv. device hrs @ Tj=25C: Jan. 1, 2002 P.41 Failure Analysis: Reliability Testing Summary High Temperature Life Test Qualification Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: XCV200E XCV300E XCV400E XCV600E XCV1000E 1 0 76 80,332 1,057 213,240 16,594,967 2.01E+08 5 1 339 212,014 625 562,788 43,797,806 5.30E+08 F/A00061(1)-MSKD 0.18 um Si Gate CMOS XCVXXXE HQFP-240, PQFP-240, BG-560 145C , *125C 0.70 ev 60% 1 0 41 20,541 501 54,526 4,243,355 5.13E+07 3 0 148 113,311 766 300,782 23,407,762 2.83E+08 1 1 19 19,019 1,001 50,486 3,928,941 4.75E+07 F/A00172(1)-GAOD ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22: Combined Lots: Failures: Device on
Page 39: Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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