Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 202 Reliability Testing Summary Package Qualification / Monitor FT-256 Device Type: Package Type: Die Attach Material: XCR3384XL, XC2S200E, XC2S300E FT-256 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot Die Shear Ball Shear Bond Pull Physical Dimension Note: Test condition for T/C was -55C/+125C 3 3 1 1 1 2 0 0 0 0 0 0 222 222 5 5 5 10 1,001 96 222,304 21,312 ®
Jan. 1, 2002 P. 203 Reliability Testing Summary Package Qualification / Monitor FF-1152, 1517 Device Type: Package Type: XC2V3000, XC2V4000, XC2V6000, FF1152, FF1517 Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle 85/85 unbiased 85/85 Die Shear Ball Shear Mark Permanency Physical Dimension Note: Test condition for T/C was -40C/+125C or 0C/+100C 11 5 4 1 3 4 1 0 0 1* 0 0 0 0 285 128 96 5 15 15 15 975 1,030 1,000 *FA01121(1)PSD 192,500 131,776 95,961 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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