Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 146 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis Number: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC18VXX, XCCACEM16, XC95XXX & XC95XXXXL Various T = -65C / +150C (Air to Air) T = -55C / +125C (Air to Air) for BGA T= -40C / +125C (Air to Air) for BG388 XC18VXX XCCACEM16 XC95XXX XC95XXXL 5 5 0 298 635 189,266 5 5 0 298 635 189,266 29 29 0 1,865 950 1,771,468 8 8 0 570 1,003 571,860 ®
Jan. 1, 2002 P. 147 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis Number: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC17XX/L PD-8 T = -65C/+150C (Air to Air) XC1701/L XC17XX 1 1 0 45 1,021 45,945 1 1 0 45 1,021 45,945 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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