Xilinx Reliability Monitor Report - Quarter 4 CY 2001

More documents

Recommendations

Info

Jan. 1, 2002 Combined Started Lot: Combined Completed Lots: P.88 Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: XCV1600E* XCV1000E XCV1000E* XCV2000E* XCVXXXE 1 1 0 22 1,000 22,000 2 2 0 46 770 35,440 Si Gate CMOS XCVXXXE HQFP-240, PQFP-240, FG-456,676,680, 860,900,1156, BGA-560, 728, CS-144 T = -65C/+150C (Air to Air) *For FG,BGA, CS, T=-55C/+125C (Air to Air) 4 4 0 122 1,078 131,515 9 9 0 219 987 216,096 26 26 0 937 1,001 938,054 ®
Jan. 1, 2002 P.89 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: XCV300EA XCV3200EA* XCVXXXEA 4 4 0 241 1,015 244,572 Si Gate CMOS XCVXXXEA PQFP-240, FG-1156, T = -65C/+150C (Air to Air) *For FG,BGA, CS, T=-55C/+125C (Air to Air) 2 2 0 56 1,000 56,000 6 6 0 297 1,012 300,572 ®
Page 1 and 2:
Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4:
Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6:
Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8:
Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10:
Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12:
Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14:
Temperature (C o ) XILINX Typical C
Page 15 and 16:
Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18:
(1) Measured on XC1765D (2) Measure
Page 19 and 20:
Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22:
Combined Lots: Failures: Device on
Page 23 and 24:
Page 25 and 26:
Page 27 and 28:
Page 29 and 30:
Page 31 and 32:
Page 33 and 34:
Page 35 and 36:
Page 37 and 38: Combined Lots: Failures: Device on
Page 47 and 48: Jan. 1, 2002 P.47 Combined Started
Page 81 and 82: Jan. 1, 2002 Combined Started Lot:
Page 87: Combined Started Lot: Combined Comp
Page 93 and 94: Jan. 1, 2002 Combined Started Lot:
Page 105 and 106: Combined Started Lot: Combined Comp
Page 127 and 128: Combined Started Lot: Combined Comp
Page 129 and 130: Jan. 1, 2002 P. 129 Combined Starte
Page 139 and 140:
Jan. 1, 2002 P. 139 Combined Starte
Page 141 and 142:
Page 143 and 144:
Page 145 and 146:
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
Page 155 and 156:
Page 157 and 158:
Page 159 and 160:
Page 161 and 162:
Page 163 and 164:
Page 165 and 166:
Page 167 and 168:
Page 169 and 170:
Combined Started Lot: Combined Comp
Page 171 and 172:
Page 173 and 174:
Jan. 1, 2002 P. 173 Reliability Tes
Page 175 and 176:
Page 177 and 178:
Page 179 and 180:
Page 181 and 182:
Page 183 and 184:
Page 185 and 186:
Page 187 and 188:
Page 189 and 190:
Page 191 and 192:
Page 193 and 194:
Page 195 and 196:
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
Page 205 and 206:
Page 207 and 208:
Page 209 and 210:
Page 211 and 212:
Page 213 and 214:
Page 215 and 216:
Page 217 and 218:
Package Details Motherboard Design
Page 219 and 220:
Package Motherboard Jan. 1, 2002 P
Page 221 and 222:
Package Motherboard Jan. 1, 2002 P
show all

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Create successful ePaper yourself

Delete template?

Save as template?