Xilinx Reliability Monitor Report - Quarter 4 CY 2001

More documents

Recommendations

Info

Jan. 1, 2002 P. 148 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis Number: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC17XXXE PD-8 T = -65C/+150C (Air to Air) XC17256E XC17XXXE 1 1 0 45 1,114 50,130 1 1 0 45 1,114 50,130 ®
Jan. 1, 2002 P. 149 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis Number: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC17SXX VOIC-8 T = -65C/+150C (Air to Air) XC17S20 XC17SXX 1 1 0 45 1,161 52,245 1 1 0 45 1,161 52,245 ®
Page 1 and 2:
Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4:
Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6:
Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8:
Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10:
Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12:
Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14:
Temperature (C o ) XILINX Typical C
Page 15 and 16:
Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18:
(1) Measured on XC1765D (2) Measure
Page 19 and 20:
Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22:
Combined Lots: Failures: Device on
Page 23 and 24:
Page 25 and 26:
Page 27 and 28:
Page 29 and 30:
Page 31 and 32:
Page 33 and 34:
Page 35 and 36:
Page 37 and 38:
Page 39 and 40:
Page 41 and 42:
Page 43 and 44:
Page 45 and 46:
Page 47 and 48:
Jan. 1, 2002 P.47 Combined Started
Page 49 and 50:
Page 51 and 52:
Page 53 and 54:
Page 55 and 56:
Page 57 and 58:
Page 59 and 60:
Page 61 and 62:
Page 63 and 64:
Page 65 and 66:
Page 67 and 68:
Page 69 and 70:
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Jan. 1, 2002 Combined Started Lot:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Combined Started Lot: Combined Comp
Page 89 and 90:
Page 91 and 92:
Page 93 and 94:
Jan. 1, 2002 Combined Started Lot:
Page 95 and 96:
Page 97 and 98: Jan. 1, 2002 P.97 Combined Started
Page 99 and 100: Combined Lots: Failures: Device on
Page 105 and 106: Combined Started Lot: Combined Comp
Page 129 and 130: Jan. 1, 2002 P. 129 Combined Starte
Page 147: Jan. 1, 2002 P. 147 Combined Starte
Page 173 and 174: Jan. 1, 2002 P. 173 Reliability Tes
Page 199 and 200:
Jan. 1, 2002 P. 199 Reliability Tes
Page 201 and 202:
Page 203 and 204:
Page 205 and 206:
Page 207 and 208:
Page 209 and 210:
Jan. 1, 2002 P. 209 Combined Starte
Page 211 and 212:
Page 213 and 214:
Page 215 and 216:
Page 217 and 218:
Package Details Motherboard Design
Page 219 and 220:
Package Motherboard Jan. 1, 2002 P
Page 221 and 222:
Package Motherboard Jan. 1, 2002 P
show all

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?