Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.33
Reliability Testing Summary
High Temperature Operating Life
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
XCS20 XCS30 XCS40 XCSXX
2
0
84
84,840
1,017
113,384
8,823,849
1.07E+08
0.35um Si Gate CMOS
XCSXX
PQFP-208
145C
0.70 ev
60%
1
0
42
42,084
1,002
111,711
8,693,704
1.05E+08
1
0
42
42,000
1,000
111,488
8,676,351
1.05E+08
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
4
0
168
168,924
1,006
448,406
34,896,283
4.22E+08
26
2
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