Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.26
Reliability Testing Summary
High Temperature Life Test
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
XC4020E XC4025E XC4XXXE
1
0
41
41,123
1,003
109,160
8,495,180
1.03E+08
0.5um, 0.6 um SiGate CMOS
XC4XXXE
PGA-156, 191, 299, PQFP-208, HQFP-240
145C
0.70 ev
60%
1
0
47
12,032
256
31,939
2,485,568
3.01E+07
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
6
0
266
163,487
615
433,974
33,773,109
4.08E+08
27
2
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