Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Mean :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
Jan. 1, 2002
P.99
Failure Analysis:
Reliability Testing Summary
High Temperature Life Test
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Temperature:
Assumed Activation Energy:
Si Gate CMOS
XCRXXXX Microcircuit Group
BG492
125C
0.7 ev @ C.L. = 60%
XCR3960
3
2
198
198,000
1,000
198,000
15,408,936
1.86E+08
131
11
F/A(2)-Std by current
®