Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.29
Reliability Testing Summary
High Temperature Operating Life
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
XC4036XL XC4062XL XC4085XL XC4XXXXL
2
0
83
62,486
753
165,868
12,908,344
1.56E+08
0.25um, 0.35 um SiGate CMOS
XC4XXXXL
PLCC-84, PQFP-208, HQFP-208,240, CB-228, PG-475
145C
0.70 ev
60%
1
0
47
12,032
256
31,939
2,485,568
3.01E+07
1
0
47
12,032
256
31,939
2,485,568
3.01E+07
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
13
0
574
440,733
768
1,169,919
91,046,527
1.10E+09
10
1
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