Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.39
Failure Analysis:
Reliability Testing Summary
High Temperature Life Test
Qualification
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
0.22um Si Gate CMOS
XCVXXX
HQFP-240, PQFP-240, *BG560, CB-228
145C , 125C*
0.70 ev
60%
XCV800 XCV800 XCV1000 XCVXXX
2
0
48
44,547
928
118,249
9,202,510
1.11E+08
*1
0
22
22,308
1,014
22,308
1,736,073
2.10E+07
*1
0
5
5,000
1,000
5,000
389,115
4.70E+06
Failure Rate(60% C.L.) in FITS @ Tj=55C:
Failure Rate(60% C.L.) in FITS @ Tj=25C:
12
1
488
392,297
804
996,166
77,524,536
9.37E+08
26
2
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