Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Started Lot: Combined Completed Lots: Jan. 1, 2002 P.104 Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCRXXXX Microcircuit Group BGA-492, TQ-44, LQ-128, TQ100, PLCC-44,84, PQFP-100 TQFP-100, CP-56, PC-28 *T = -55C/+125C (Air to Air) T= -65C/+150C (Air to Air) XCR3960* XCR5064* XCR3(5)128 3 3 0 89 1,000 89,000 3 3 0 224 1,000 224,000 7 7 1 614 475 291,600 F/A(1)-Single bit charge loss ®
Combined Started Lot: Combined Completed Lots: Jan. 1, 2002 P.105 Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: XCR3(5)064 XCR22(L)V10 XCRXXXX 4 4 0 276 1,000 276,000 Si Gate CMOS XCRXXXX & XCRXXVXX Microcircuit Group BGA-492, TQ-44, LQ-128, TQ100, PLCC-44,84, PQFP-100 TQFP-100, CP-56, PC-28, SO-24, VO24 *T = -55C/+125C (Air to Air) T= -65C/+150C (Air to Air) 5 5 0 456 833 380,000 21 21 1 1,371 887 1,215,600 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 P. 173 Reliability Tes
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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