Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.40
Failure Analysis:
Reliability Testing Summary
High Temperature Operating Life
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
0.22 um Si Gate CMOS
XCVXXX
PQFP-240
145C
0.70 ev
60%
XCV300 XCVXXX
(Dynamic)
2
0
41
41,000
1,000
108,834
8,469,771
1.02E+08
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
2
0
41
41,000
1,000
108,834
8,469,771
1.02E+08
108
9
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