Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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1. This reliability report is published by Xilinx to provide insight to our customers regarding the reliability of Xilinx products. Reliability is defined as product performance to specification over time in response to varied (specified) environmental stress. The ultimate goal of our reliability program is to achieve continuous improvement in the robustness of the product being evaluated. Jan. 1, 2002 P. 4 As part of this program, finished product reliability is measured periodically to ensure that the product performance meets or exceeds internal and external reliability specifications. Reliability programs are executed in response to internal programs as well as to individual customer requirements. All testing is performed or supervised by experienced Xilinx employees using facilities which are approved and audited by Xilinx for compliance to the requirements of DSCC- VAC and MIL-STD-883 requirements. 2. The Reliability Program: The reliability qualifications of new devices, wafer processes, and packages are designed to ensure that these Xilinx’s products satisfy the internal and external customer requirements before transfer into production. The reliability qualification and monitor requirements will be outlined as follows:
Jan. 1, 2002 P. 5 2.1 Wafer Process Qualification Reliability Test Condition Duration High Temperature Operating Life (HTOL) Temperature Humidity Bias (THB) or High Accelerated stress Test (HAST) Temperature Cycling (TC) High Temperature Storage (HTS) C Data RetentionD Program EraseC,D Note: Ta >/=125°C, V DD Max 85°C, 85% R.H., V DD or 130°C, 85% R.H., V DD Lot Qty SS/lot A Acceptance 1,000 hours 3 76 0 fail 1,000 hours or 100 hours 2 76 0 fail -65°C/+150°C or -55°C/+125°C B 500 cycles or 1 76 0 fail 1,000 cycles Ta = 150°C 1,000 hours 1 76 0 fail Ta = 150°C 1,000 hours 1 76 0 fail Ta = 75°C 10,000 cycles 1 76 0 fail A. The sample size listed is based on the die size
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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