Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
Combined Started Lot:
Combined Completed Lots:
P.72
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Failure Analysis Number:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
Si Gate CMOS
XC4XXX/E, XC4XXXXLA
Various
T = -65C / +150C (Air to Air)
T = -55C / +125C (Air to Air) for BGA,FG,CS
XC4XXX XC4XXXE XC4XXXXL XC4XXXXLA
1
1
0
76
1,000
76,000
4
4
0
110
1,014
111,505
10
10
0
421
1,006
423,645
3
3
0
134
1,000
134,000
®