Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P.54 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Failure Analysis Number:` Reliability Testing Summary-Packages Bias Moisture Life Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCVXXX TQFP-144, BGA-432,560, FG-256, 680 T = 85C, R.H. = 85% XCV100 XCV200 XCV600 XCV1000 XCVXXX 1 1 0 60 1,061 63,660 1 1 1 21 1,006 21,126 F/a00167(1)-ASL 2 2 0 40 1,046 41,824 1 1 0 32 1,080 34,560 5 5 1 153 1,053 161,170 ®
Jan. 1, 2002 P.55 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Failure Analysis Number: Reliability Testing Summary-Packages Bias Moisture Life Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCVXXXE CS-144, BGA-728, 560, FG-680, 1156 T = 85C, R.H. = 85% XCV200E XCV1000E XCV2000E XCVXXXE 1 1 0 74 1,043 77,159 1 1 0 32 1,148 36,740 4 4 0 98 1,033 101,229 6 6 0 204 1,055 215,128 ®
Page 1 and 2:
Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Started Lot: Combined Comp
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Jan. 1, 2002 P.107 Combined Started
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Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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