Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P.106 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCRXXXXL Microcircuit Group TQ-144, CS-144, 48, 280, VQFP-44, PLCC-44 *T = -55C/+125C (Air to Air) T = -65C/+150C (Air to Air) XCR3256XL XCR3032XL XCR3128XL XCR3364XL 2 2 0 150 909 136,342 *1 1 0 76 1,077 81,852 2 2 0 152 1,000 152,000 *1 1 0 76 1,000 76,000 *1 1 0 76 1,000 76,000 *1 1 0 50 1,000 50,050 ®
Jan. 1, 2002 P.107 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Cycles/Device: Total Device Cycles: Failure Analysis: Reliability Testing Summary-Packages Temperature Cycle (Air to Air) Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCRXXXXL Microcircuit Group TQ-144, CS-144, 48, 280, VQFP-44, PLCC-44 PQFP-208, FT-256 *T = -65C/+150C (Air to Air) T = -55C/+125C (Air to Air) XCR3064XL XCR3384XL XCRXXXXXL 1 1 0 76 1,343 104,348 *1 1 0 76 1,021 77,596 1 1 0 76 1,000 76,000 *1 1 0 76 1,000 76,000 12 12 0 884 1,025 906,188 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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