Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
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Combined Lots:<br />
Failures:<br />
Device on test:<br />
Actual device hours:<br />
Mean :<br />
Equivalent device hours @ Tj=125C:<br />
Equivalent device hours @ Tj=55C:<br />
Equivalent device hours @ Tj=25C:<br />
Jan. 1, 2002<br />
P.101<br />
Failure Analysis:<br />
<strong>Reliability</strong> Testing Summary<br />
High Temperature Life Test<br />
Qualification & <strong>Monitor</strong> Combined<br />
Technology:<br />
Device Type:<br />
Package Type:<br />
Actual Temperature:<br />
Assumed Activation Energy:<br />
Si Gate CMOS<br />
XCR3XXXXL<br />
TQ-144, VQ-100<br />
145C<br />
0.7 ev @ C.L. = 60%<br />
XCR3032XL XCR3256XL XCR3064XL XCR3128XL XCR3XXXXL<br />
2<br />
0<br />
152<br />
118,712<br />
781<br />
315,119<br />
24,523,499<br />
2.97E+08<br />
1<br />
0<br />
77<br />
39,732<br />
516<br />
105,468<br />
8,207,828<br />
9.92E+07<br />
1<br />
0<br />
78<br />
156,468<br />
2,006<br />
415,342<br />
32,323,125<br />
3.91E+08<br />
1<br />
0<br />
78<br />
85,524<br />
1,0258<br />
219,059<br />
17,047,790<br />
2.06E+08<br />
Failure Rate (60% C.L.) in FITS @ Tj=55C:<br />
Failure Rate (60% C.L.) in FITS @ Tj=25C:<br />
5<br />
0<br />
385<br />
397,436<br />
1,032<br />
1,054,988<br />
82,102,243<br />
9.93E+08<br />
11<br />
1<br />
®
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