Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 16 ESD and Latch-up Data Device Latch-Up Human Body Model Charge Device Model XCVXXXX +/- 200 mA +1000V to +1800V +500V (11) XCVXXXE +/- 210 mA +1000V to +2500V(23) +300V (12) XCVXXXEA +/- 210 mA +2000V to +3000V +500V (13) XCSXX +/- 310 mA +6000V +1000V (14) XCSXXXL +/- 250 mA +3000V +500V (15) XC2SXXX +/- 210 mA +2000V +500V (16)(17) XC5XXX +/- 250 mA +3000V to +7000V +2000V (18) XC95XXX +/- 250 mA +2000V to +4000V +1000V (19) XC95XXXL +/- 350 mA +2000V to +4000V +1000V (20) XCRXXX +/- 210 mA +2000V to +4000V +500V (21) XC2VXXX(22) +/- 200 mA +1500V to +2000V(23) +500V ®
(1) Measured on XC1765D (2) Measured on XC3090 (3) Measured on XC3190/A (4) Measured on XC4005 (5) Measured on XC4005E (6) Measured on XC4010E (7) Measured on XC4028XL (8) Measured on XC17256E (9) measured on XC18V04 (10) Measured on XC4062XLA (11)Measured on XCV800 (12)Measured on XCV50E (13)Measured on XCV2600EA, XCV3200EA (14) Measured on XCS10 & XCS30 (15) Measured on XCS30XL (16) Measured on XC2S200 (17)Measured on XC2S150 (18) Measured on XC5210 Jan. 1, 2002 P. 17 (19) Measured on XC95108 (20)Measured on XC9536XL (21)Measured on XCR3064 (22)Based on the data collected on XC2V1000, XC2V6000 & XC2V4000. As other devices’ data available, this will be updated in the future.For HBM, only XC2V4000 device has ESD threshold below 2KV (passing at 1.5KV) (23)Only XCV100E and XCV812E have ESD threshold below 2KV, (XCV100E passed at 1.5KV and XCV812E passed at 1KV), (24) Both ESD & Latch-up tests performed @ Room temperature. (25) ESD results do not include Dxn & Dxp pins ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
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Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15: Jan. 1, 2002 P. 15 ESD and Latch-up
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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