Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equivalent device hours @ Tj=125C:
Equivalent device hours @ Tj=55C:
Equivalent device hours @ Tj=25C:
Jan. 1, 2002
P.37
Reliability Testing Summary
High Temperature Operating Life
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
0.22/0.18um Si Gate CMOS
XC2SXXX
PQFP-208, 240
145C
0.70 ev
60%
XC2S150 XC2S200 XC2SXXX
9
0
493
418,945
850
1,112,083
86,545,567
1.05E+09
1
0
76
57,836
761
153,525
11,947,748
1.44E+08
Failure Rate (60% C.L.) in FITS @ Tj=55C:
Failure Rate (60% C.L.) in FITS @ Tj=25C:
16
0
1,025
815,361
795
2,164,364
168,437,098
2.04E+09
5
1
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