Bulletin 2009/07 - European Patent Office
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Bulletin 2009/07 - European Patent Office

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(H01L) I.1(2)<br />

• Integrated heat sink for semiconductor<br />

modules<br />

• Dissipateur de chaleur intégré pour<br />

modules semi-conducteurs<br />

(71) Mitsubishi Electric Corporation, 7-3, Marunouchi<br />

2-chome, Chiyoda-ku Tokyo 100-<br />

8310, JP<br />

(72) Kimura, Toru, Tokyo 100-8310, JP<br />

Shirakata, Yuji, Tokyo 100-8310, JP<br />

(74) Sajda, Wolf E., et al, Meissner, Bolte &<br />

Partner GbR Postfach 86 06 24, 81633<br />

München, DE<br />

(51) H01L 23/473 (11) 2 023 390 A1<br />

H01L 25/065 H01L 23/367<br />

(25) En (26) En<br />

(21) 08161413.3 (22) 30.<strong>07</strong>.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(30) 09.08.20<strong>07</strong> JP 20<strong>07</strong>2<strong>07</strong>962<br />

(54) • Halbleitervorrichtung<br />

• Semiconductor device<br />

• Dispositif semi-conducteur<br />

(71) Shinko Electric Industries Co., Ltd., 80,<br />

Oshimada-machi, Nagano-shi, Nagano 381-<br />

2287, JP<br />

(72) Sunohara, Masahiro, Nagano-shi Nagano<br />

381-2287, JP<br />

Higashi, Mitsutoshi, Nagano-shi Nagano<br />

381-2287, JP<br />

(74) Fenlon, Christine Lesley, Haseltine Lake<br />

Lincoln House 300 High Holborn, London<br />

WC1V 7JH, GB<br />

H01L 23/473 → (51) H01L 33/00<br />

H01L 23/48 → (51) H01L 21/66<br />

H01L 23/52 → (51) H01L 21/60<br />

H01L 25/065 → (51) H01L 23/473<br />

(51) H01L 25/13 (11) 2 023 391 A2<br />

(25) En (26) En<br />

(21) 08158584.6 (22) 19.06.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(30) 22.06.20<strong>07</strong> CN 20<strong>07</strong>20120960 U<br />

(54) • Flexibler LED-Schirm<br />

• Flexible LED screen<br />

• Écran DEL flexible<br />

(71) Yuen, Ronald Sik Hung, Room 11, 10/F<br />

Block B, Merit Industrial Center 94 Tokwawan<br />

Road Kowloon Hong Kong, CN<br />

Wang, Haoran, Room 11, 10/F Block B, Merit<br />

Industrial Center 94 Tokwawan Road Kowloon<br />

Hong Kong, CN<br />

(72) Yuen, Ronald Sik Hung, Room 11, 10/F<br />

Block B, Merit Industrial Center 94 Tokwawan<br />

Road Kowloon Hong Kong, CN<br />

Wang, Haoran, Room 11, 10/F Block B, Merit<br />

Industrial Center 94 Tokwawan Road Kowloon<br />

Hong Kong, CN<br />

(74) Hüttermann, Aloys, Michalski Hüttermann &<br />

Partner <strong>Patent</strong>anwälte Neuer Zollhof 2,<br />

40221 Düsseldorf, DE<br />

H01L 27/00 → (51) G06K 19/<strong>07</strong>7<br />

(51) H01L 27/02 (11) 2 023 392 A1<br />

(25) It (26) En<br />

(21) <strong>07</strong>425517.5 (22) 08.08.20<strong>07</strong><br />

Europäisches <strong>Patent</strong>blatt<br />

<strong>European</strong> <strong>Patent</strong> <strong>Bulletin</strong><br />

<strong>Bulletin</strong> européen des brevets<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HU IE IS IT LI LT LU LV MC MT NL PL PT<br />

RO SE SI SK TR<br />

AL BA HR MK RS<br />

(54) • Integrierte Schaltung mit Vorrichtung zum<br />

Schutz vor elektrostatischen Entladungen<br />

• Integrated circuit with device for protecting<br />

against electrostatic discharges<br />

• Circuit intégré avec dispositif pour la<br />

protection contre les décharges électrostatiques<br />

(71) STMicroelectronics S.r.l., Via C. Olivetti, 2,<br />

20041 Agrate Brianza (Milano), IT<br />

(72) Confalonieri, Pierangelo, 20040 Caponago<br />

(Milano), IT<br />

Martignone, Riccardo, 20040 Carnate<br />

(Milano), IT<br />

Pernici, Sergio, 24125 Bergamo, IT<br />

(74) Carangelo, Pierluigi, et al, Jacobacci &<br />

Partners S.p.A. Via delle Quattro Fontane, 15,<br />

00184 Roma, IT<br />

H01L 27/02 → (51) G09G 3/34<br />

H01L 27/02 → (51) H03K 17/04<br />

H01L 27/06 → (51) H01L 31/10<br />

(51) H01L 27/105 (11) 2 023 393 A1<br />

G11C 13/00 H01L 45/00<br />

(25) Ja (26) En<br />

(21) 06756849.3 (22) 31.05.2006<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HU IE IS IT LI LT LU LV MC NL PL PT RO<br />

SE SI SK TR<br />

AL BA HR MK YU<br />

(86) JP 2006/310929 31.05.2006<br />

(87) WO 20<strong>07</strong>/138703 20<strong>07</strong>/49 06.12.20<strong>07</strong><br />

(54) • HALBLEITERBAUELEMENT<br />

• SEMICONDUCTOR DEVICE<br />

• DISPOSITIF À SEMI-CONDUCTEUR<br />

(71) Renesas Technology Corp., 4-1, Marunouchi<br />

2-chome Chiyoda-ku, Tokyo 100-6334, JP<br />

(72) TAKAURA, Norikatsu, Kokubunji-shi Tokyo<br />

185-8601, JP<br />

MATSUI, Yuichi, Kokubunji-shi Tokyo 185-<br />

8601, JP<br />

TERAO, Motoyasu, Kokubunji-shi Tokyo<br />

185-8601, JP<br />

FUJISAKI, Yoshihisa, Kokubunji-shi Tokyo<br />

185-8601, JP<br />

MATSUZAKI, Nozomu, Kokubunji-shi Tokyo<br />

185-8601, JP<br />

KUROTSUCHI, Kenzo, Kokubunji-shi Tokyo<br />

185-8601, JP<br />

MORIKAWA, Takahiro, Kokubunji-shi Tokyo<br />

185-8601, JP<br />

(74) Calderbank, Thomas Roger, et al, Mewburn<br />

Ellis LLP 33 Gutter Lane, London EC2V 8AS,<br />

GB<br />

(51) H01L 27/12 (11) 2 023 394 A1<br />

H01L 21/66<br />

(25) Ja (26) En<br />

(21) <strong>07</strong>743<strong>07</strong>4.2 (22) 10.05.20<strong>07</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HU IE IS IT LI LT LU LV MC MT NL PL PT<br />

RO SE SI SK TR<br />

AL BA HR MK RS<br />

(86) JP 20<strong>07</strong>/059639 10.05.20<strong>07</strong><br />

(87) WO 20<strong>07</strong>/138828 20<strong>07</strong>/49 06.12.20<strong>07</strong><br />

(30) 30.05.2006 JP 2006149866<br />

(54) • VERFAHREN ZUM BEWERTEN EINES SOI-<br />

WAFERS<br />

• METHOD FOR EVALUATING SOI WAFER<br />

• PROCÉDÉ D'ÉVALUATION D'UNE PLA-<br />

QUETTE SOI<br />

347<br />

Anmeldungen<br />

Applications<br />

Demandes (<strong>07</strong>/<strong>2009</strong>) 11.02.<strong>2009</strong><br />

(71) Shin-Etsu Handotai Co., Ltd., 6-2, Ohtemachi<br />

2-chome Chiyoda-ku, Tokyo, JP<br />

(72) YOSHIDA, Kazuhiko, Chikuma-shi, Nagano<br />

387-8555, JP<br />

(74) Wibbelmann, Jobst, Wuesthoff & Wuesthoff<br />

<strong>Patent</strong>- und Rechtsanwälte Schweigerstrasse<br />

2, 81541 München, DE<br />

H01L 27/12 → (51) H01L 21/02<br />

H01L 27/14 → (51) H01L 31/10<br />

(51) H01L 27/142 (11) 2 023 395 A2<br />

H01L 31/<strong>07</strong>5<br />

(25) En (26) En<br />

(21) 08252322.6 (22) 08.<strong>07</strong>.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(30) 09.<strong>07</strong>.20<strong>07</strong> JP 20<strong>07</strong>179438<br />

(54) • Fotovoltaische Vorrichtung und Herstellungsverfahren<br />

dafür<br />

• Photovoltaic apparatus and method of<br />

manufacturing the same<br />

• Dispositif photovoltaïque et son procédé de<br />

fabrication<br />

(71) Sanyo Electric Co., Ltd., 5-5 Keihan-Hondori<br />

2-chome Moriguchi-shi, Osaka 570-8677, JP<br />

(72) Shinohara, Wataru , c/o Sanyo Electric Co.<br />

Ltd., Moriguchi-shi, Osaka 570-8677, JP<br />

(74) Calderbank, Thomas Roger, et al, Mewburn<br />

Ellis LLP 33 Gutter Lane, London EC2V 8AS,<br />

GB<br />

H01L 27/146 → (51) H04N 5/335<br />

(51) H01L 27/32 (11) 2 023 396 A1<br />

G02F 1/1333 G09F 9/33<br />

(25) En (26) En<br />

(21) 08252383.8 (22) 11.<strong>07</strong>.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(30) 02.08.20<strong>07</strong> KR 20<strong>07</strong>0<strong>07</strong>7727<br />

(54) • Anzeigevorrichtung<br />

• Display device<br />

• Dispositif d'affichage<br />

(71) Samsung SDI Co., Ltd., 575 Shin-dong,<br />

Yeongtong-gu, Suwon-si, Gyeonggi-do, KR<br />

(72) Yoon, Ji-Hwan, Suwon-si Gyeonggi-do, KR<br />

Lee, Kwan Hee, Suwon-si Gyeonggi-do, KR<br />

(74) Mounteney, Simon James, Marks & Clerk 90<br />

Long Acre, London WC2E 9RA, GB<br />

H01L 31/00 → (51) B64G 1/44<br />

(51) H01L 31/02 (11) 2 023 397 A1<br />

G02B 6/42 H01S 5/022<br />

(25) Ja (26) En<br />

(21) <strong>07</strong>743386.0 (22) 15.05.20<strong>07</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HU IE IS IT LI LT LU LV MC MT NL PL PT<br />

RO SE SI SK TR<br />

AL BA HR MK RS<br />

(86) JP 20<strong>07</strong>/059951 15.05.20<strong>07</strong><br />

(87) WO 20<strong>07</strong>/135897 20<strong>07</strong>/48 29.11.20<strong>07</strong><br />

(30) 18.05.2006 JP 2006139146<br />

(54) • LICHTSENDE-/EMPFANGSEINRICHTUNG<br />

• LIGHT TRANSMITTING/RECEIVING<br />

DEVICE<br />

• DISPOSITIF TRANSMETTEUR/RÉCEPTEUR<br />

DE LUMIÈRE<br />

(71) Hamamatsu Photonics K.K., 1126-1, Ichinocho,<br />

Higashi-ku, Hamamatsu-shi, Shizuoka<br />

435-8558, JP

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