~ National ~ Semiconductor - Al Kossow's Bitsavers

More documents

Recommendations

Info

~National ~ Semiconductor MM74HC942 300 Baud Modem General Description The MM74HC942 is a full duplex low speed modem. It provides a 300 baud bidirectional serial interface for data communication over telephone lines and other narrow bandwidth channels. It is Bell 103 compatible. The MM74HC942 utilizes advanced silicon-gate CMOS technology. Switched capacitor techniques are used to perform analog signal processing. MODULATOR SECTION The modulator contains a frequency synthesizer and a sine wave synthesizer. It produces a phase coherent frequency shift keyed (FSK) output. LINE DRIVER AND HYBRID SECTION The line driver and hybrid are designed to facilitate connection to a 600n phone line. They can perform two-to-fourwire conversion and drive the line at a maximum of 0 dBm. DEMODULATOR SECTION The demodulator incorporates anti-aliasing filters, a receive filter, limiter, discriminator, and carrier detect circuit. The nine pole receive filter provides 60 dB of transmitted tone rejection. The discriminator is fully balanced for stable operation. Features • Drives 600n at 0 dBm • All filters on chip • Transmit level adjustment compatible with universal service order code • TTL and CMOS compatible logic • All inputs protected against static damage • ± 5V supplies • Low power consumption • Full duplex answer or originate operation • Analog loopback for self test • Power down mode Applications • Built-in low speed modems • Remote data collection • Radio telemetry • Credit verification • Stand-alone modems • Point-of-sale terminals • Tone signalling systems • Remote process control Connection and Block Diagrams Dual-In-Line Package Vee DND Vaa XTALS XTALD DSI TLA ALB 19 C1ND co 18 EXI CDT 17 TXA TLA-i---1 RXD 18 RXAI Vcc 15 RXA2 CDA 14 SQT XTALD 13 oil. XTALS 12 Vee DSI-ll---.... -j....----, TIlA -+--.... -C~ FTLC 10 11 TXD Top View TL/F/5348-1 Order Number MM54HC942* or MM74HC942' 'Please look into Section 8, Appendix D for availability of various package types. EXI-l-.:==:;:..----- RXA1-1----t CDA COT FTLC TL/F/5348-2 5-3
Absolute Maximum Ratings (Notes 1 & 2) Operating Conditions If Military I Aerospace specified devices are required, Min Max Units contact the National Semiconductor Sales Offlcel Supply Voltage (Veel 4.5 5.5 V Distributors for availability and specifications. Supply Voltage (Vee) -4.5 -5.5 V Supply Voltage (Vee) -0.5 to + 7.0V DC Input or Output Voltage 0 Vee V Supply Voltage (Vee) +0.5to -7.0V (VIN, VOUT) DC Input Voltage (VIN) Vee-1.5 to Vee + 1.5V Operating Temp. Range (T A) DC Output Voltage (VOUT) Vee-0.5to Vee+ 0.5V MM74HC -40 +85 'C Clamp Diode Current (11K, 10K) ±20mA Input Rise or Fall Times DC Output Current, per pin (lOUT) ±25mA (tr,tf) 500 ns DC Vee or GND Current, per pin (Ieel ±50mA Crystal frequency 3.579 MHz Storage Temperature Range (T 8TG) Power Dissipation (Po) (Note 3) S.O. Package only Lead Temp. (TO (Soldering 10 seconds) -65'C to + 150'C 600mW 500mW 260'C DC Electrical Characteristics 74HC T=25'C Symbol Parameter Conditions T= -40 to 85'C Units Typ Guaranteed Limits VIH Minimum High Level 3.15 3.15 V Input Voltage VIL Maximum Low Level 1.1 1.1 V Input Voltage VOH Minimum High Level VIN = VIH or VIL Output Voltage IIOUTI=20J.'A Vee Vee-0.1 Vee-0.1 V IIOUTI =4.0 mA, Vee=4.5V 3.98 3.7 V VOL Maximum Low Level VIN = VIH or VIL Voltage IiOUTI=20J.'A 0.1 0.1 V IIOUTI = 4.0 mA, Vee = 4.5V 0.26 0.4 V liN Maximum Input VIN = Vee or GND ±0.1 ±1.0 J.'A Current loz Output TRI-STATE® ALB=SQT=Vee ±5 J.'A Leakage Current RXD and CD Outputs Icc, lee Maximum Quiescent VIH = Vee, VIL =GND 8.0 12.0 12.0 mA Supply Current ALB or SQT = GND Transmit Level = - 9 dBm Icc, lee Power Down Supply Current ALB=SQT=Vee 300 J.'A VIH = Vee, VIL =GND Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages afe referenced to ground. Note 3: Power Dissipation temperature derating - plastic "N'" package: -12 mW rc from 65'C to 85'C; ceramic" J'" package: -12 mW rc from 1 QQ'C to 125'C. 'The demodulator specifications apply to the MM74HC942 operating with a modulator having frequency accuracy, phase iitter and harmonic content equal to or better than the MM74HC942 modulator. 5-4
Page 1 and 2:
~ National ~ Semiconductor 400014 R
Page 3 and 4:
TRADEMARKS Following is the most cu
Page 5 and 6:
II) c ~ ~National ~ ~ Semiconductor
Page 7 and 8:
Table of Contents (Continued) Secti
Page 9 and 10:
Alpha-Numeric Index(continUed) DS36
Page 12 and 13:
Section 1 Local Area Networks IEEE
Page 14 and 15:
~National ~ Semiconductor DP8390C/N
Page 16 and 17:
3.0 Functional Description (Continu
Page 18 and 19:
5.0 Pin Descriptions (Continued) BU
Page 20 and 21:
6.0 Direct Memory Access Control (D
Page 22 and 23:
7.0 Packet Reception (Continued) Re
Page 24 and 25:
8.0 Packet Transmission (Continued)
Page 26 and 27:
10.0 Internal Registers (Continued)
Page 28 and 29:
Page 30 and 31:
Page 32 and 33:
Page 34 and 35:
Page 36 and 37:
.----------------------------------
Page 38 and 39:
Page 40 and 41:
12.0 Loopback Diagnostics (Continue
Page 42 and 43:
13.0 Bus Arbitration and Timing The
Page 44 and 45:
13.0 Bus Arbitration and Timing (Co
Page 46 and 47:
Page 48 and 49:
15.0 Switching Characteristics AC S
Page 50 and 51:
15.0 Switching Characteristics (Con
Page 52 and 53:
Page 54 and 55:
Page 56 and 57:
Page 58 and 59:
Page 60 and 61:
Page 62 and 63:
Page 64 and 65:
AC Timing Test Conditions Input Pul
Page 66 and 67:
2.0 Block Diagram COL CRS PROTOCOL
Page 68 and 69:
4.0 Transmit/Receive Packet Encapsu
Page 70 and 71:
5.0 Pin Descriptions (Continued) BU
Page 72 and 73:
7.0 Packet Reception (Continued) fo
Page 74 and 75:
7.0 Packet Reception (Continued) Er
Page 76 and 77:
9.0 Remote DMA The Remote DMA chann
Page 78 and 79:
Page 80 and 81:
Page 82 and 83:
Page 84 and 85:
Page 86 and 87:
Page 88 and 89:
Page 90 and 91:
11.0 Initialization Procedures (Con
Page 92 and 93:
13.0 Bus Arbitration and Timing The
Page 94 and 95:
-----------------------------------
Page 96 and 97:
Page 98 and 99:
15.0 Switching Characteristics AC S
Page 100 and 101:
Page 102 and 103:
Page 104 and 105:
Page 106 and 107:
-----------------------------------
Page 108 and 109:
Page 110 and 111:
Page 112 and 113:
Page 114 and 115:
AC Timing Test Conditions Input Pul
Page 116 and 117:
2.0 Block Diagram TRANSCEIVER CABLE
Page 118 and 119:
PCC Connection Diagram 39.0. 39.0.
Page 120 and 121:
6.0 Absolute Maximum Ratings Recomm
Page 122 and 123:
9.0 Timing and Load Diagrams (Conti
Page 124 and 125:
Page 126 and 127:
2.0 Block Diagram COAX CABLE r ____
Page 128 and 129:
~~L ~------------------------------
Page 130 and 131:
6.0 Absolute Maximum Ratings (Note
Page 132 and 133:
Page 134 and 135:
-----------------------------------
Page 136 and 137:
-----------------------------------
Page 138 and 139:
I: • • • • • • Interrup
Page 140 and 141:
PAL20LB Decode and DMA Interface Lo
Page 142 and 143:
~ U16/8 R1 R1,R2=4.7k.o. Note: For
Page 144 and 145:
Although Cheapernet is intended for
Page 146 and 147:
The transmitted packet from the SNI
Page 148 and 149:
Truth Table for Various Collision D
Page 150 and 151:
CHEAPERNET APPLICATION WITH THE DP8
Page 152 and 153:
DP8390 Network Interface Controller
Page 154 and 155:
ping between the received address a
Page 156 and 157:
If the current local DMA address ev
Page 158 and 159:
6.2 Dual Port Memory One popular me
Page 160 and 161:
StarLAN With The DP839EB Evaluation
Page 162 and 163:
SUPPORTING DOCUMENTS The following
Page 164 and 165:
Pulse Transformer U3 .----. j " "P>
Page 166:
ELECTROSTATIC DISCHARGE TEST (ESD)
Page 169 and 170:
Section 2 Contents DP8340INS32440 I
Page 171 and 172:
.. 0 C'I C") en .... z 0 C") GO Go
Page 173 and 174:
~ 'OIl' N CO) (J) Z .... o 'OIl' CO
Page 175 and 176:
Timing Characteristics Oscillator F
Page 177 and 178:
Timing Waveforms (Continued) TA REG
Page 179 and 180:
.. ... ~ ~National ~ ~ Semiconduc
Page 181 and 182:
Detailed Functional Pin Description
Page 183 and 184:
Message Format (Continued) DATA REC
Page 185 and 186:
Timing Characteristics (Notes 2, 6,
Page 187 and 188:
Timing Waveforms (Continued) 4T±(T
Page 189 and 190:
Typical Applications (Continued) +5
Page 191 and 192:
N r--------------------------------
Page 193 and 194:
~ ..,. r---------------------------
Page 195 and 196:
Timing Characteristics (Continued)
Page 197 and 198:
Functional Timing Waveforms (Contin
Page 199 and 200:
Typical Applications (Continued) DA
Page 201 and 202:
C") "Ot "Ot N C") en ...... z C") "
Page 203 and 204:
) r--------------------------------
Page 205 and 206:
Absolute Maximum Ratings (Note 1) I
Page 207 and 208:
(W) r------------------------------
Page 209 and 210:
M r--------------------------------
Page 211 and 212:
MUX~ __________________ The BIPLAN
Page 213 and 214:
U) ,-------------------------------
Page 215 and 216:
~r---------------------------------
Page 217 and 218:
~ .--------------------------------
Page 219 and 220:
An EPROM implementation was selecte
Page 221 and 222:
MASTER MUL TIPLEXING/DE-MUL TIPLEXI
Page 223 and 224:
AN·496 '" 0, '" (U17/ (U23/6) TO 5
Page 225 and 226:
AN-496 t W19 ~ J2-43 I' [; 0 J2-42
Page 227 and 228:
AN·496
Page 229 and 230:
DP8342/DP8343 HIGH SPEED INTERFACE
Page 231 and 232:
2.0 Connection Diagram A13- 12 A12-
Page 233 and 234:
3.0 Pin Descriptions (Continued) Si
Page 235 and 236:
~ ~ 4.0 Electrical Specifications (
Page 237 and 238:
4.0 Electrical Specifications (Cont
Page 239 and 240:
~ ~ 4.0 Electrical Specifications (
Page 241 and 242:
Page 243 and 244:
c( '
Page 245 and 246:
~L ______________ ___ ~ ~ 4.0 Elect
Page 247 and 248:
Page 249 and 250:
Page 251 and 252:
Page 253 and 254:
Page 255 and 256:
Page 257 and 258:
Page 259 and 260:
5.0 Instruction Set Overview (Conti
Page 261 and 262:
Page 263 and 264:
Page 265 and 266:
Page 267 and 268:
6.0 Instruction Set Reference (Cont
Page 269 and 270:
Page 271 and 272:
~ ,--------------------------------
Page 273 and 274:
Page 275 and 276:
Page 277 and 278:
~ C') 6.0 Instruction Set Reference
Page 279 and 280:
Page 281 and 282:
Page 283 and 284:
Page 285 and 286:
Page 287 and 288:
Page 289 and 290:
Page 291 and 292:
Page 293 and 294:
! 6.0 Instruction Set Reference (Co
Page 295 and 296:
~ ~ 6.0 Instruction Set Reference (
Page 297 and 298:
== ~ 6.0 Instruction Set Reference
Page 299 and 300:
7.0 CPU Registers (Continued) BIT I
Page 301 and 302:
7.0 CPU Registers (Continued) BIRO
Page 303 and 304:
7.0 CPU Registers (Continued) 76543
Page 305 and 306:
7.0 CPU Registers (Continued) BIT D
Page 307 and 308:
7.0 CPU Registers (Continued) BIT D
Page 310 and 311:
8.0 Remote Interface and Arbitratio
Page 312 and 313:
Page 314 and 315:
Page 316 and 317:
Page 318 and 319:
Page 320 and 321:
~ ~ HASM state TCU state eLK-OUT RE
Page 322 and 323:
~I tn tn ...._,__'RS A RS, RSC IMEM
Page 324 and 325:
Page 326 and 327:
~ 01 CO RASM stat. TCU stat. CLK-OU
Page 328 and 329:
~ ~ I\~"'''' I 'ow = "[OW2-0) , RS
Page 330 and 331:
Page 332 and 333:
~ 8l HASM stat. TCU stat. CU- C» b
Page 334 and 335:
.----------------------------------
Page 336 and 337:
10.0 Transceiver (Continued) (a) 32
Page 338 and 339:
10.0 Transceiver (Continued) TABLE
Page 340 and 341:
10.0 Transceiver (Continued) dotted
Page 342 and 343:
10.0 Transceiver (Continued) TABLE
Page 344 and 345:
10.0 Transceiver (Continued) {also
Page 346 and 347:
-----------------------------------
Page 348 and 349:
Decoding Bit Fields with the JRMK I
Page 350 and 351:
Receiver Interrupts/Flags for the D
Page 352 and 353:
****************DA ISR*************
Page 354 and 355:
"Interrupts"-A Powerful Tool of the
Page 356 and 357:
TABLE II. (lCR) Interrupt Mask Bits
Page 358 and 359:
Running the DP8344 with wait states
Page 360 and 361:
» z I U'I Q 01:00 INSTRUCTION ADDR
Page 362 and 363:
WHY EPROM SOFT-LOAD? In a stand-alo
Page 364 and 365:
-----------------------------------
Page 366 and 367:
RESET ~. Timing at Beginning of Ins
Page 368 and 369:
.. I CRYSTAL ~~~.~ I UP TO 64K OP83
Page 370 and 371:
-----------------------------------
Page 372 and 373:
-----------------------------------
Page 374 and 375:
The roll-off frequency, Fro, should
Page 376 and 377:
ceives messages whose first frame a
Page 378 and 379:
RECEIVER INTERRUPT The receiver int
Page 380 and 381:
JMP n LJMP n JMPR Rs JMPI Ptr JRMK
Page 382 and 383:
-----------------------------------
Page 384 and 385:
,----------------------------------
Page 386 and 387:
00044 F90a :J- 226 Z • 227 MOVE A
Page 388 and 389:
l> Z 00074 80BD 2'18 en • 00075 0
Page 390 and 391:
Section 3 ISDN Components
Page 392 and 393:
Introduction To National Semiconduc
Page 394 and 395:
NSC Solutions for Layers 2 and 3 Na
Page 396 and 397:
NSC Solutions: Systems Level Basic
Page 398 and 399:
-----------------------------------
Page 400 and 401:
~National ~ Semiconductor PRELIMINA
Page 402 and 403:
ISDN DEFINITIONS "B" Channel, or DS
Page 404:
~ '" TE2 UP TO 8 TERMINALS -
Page 407 and 408:
Section 4 Contents INS8250/INS8250-
Page 409 and 410:
m . r------------------------------
Page 411 and 412:
3.0 AC Electrical Characteristics T
Page 413 and 414:
. ID
Page 415 and 416:
5.0 Block Diagram INTERNAL DATA IUS
Page 417 and 418:
6.0 Pin Descriptions (Continued) In
Page 419 and 420:
8.0 Registers (Continued) and 1, on
Page 421 and 422:
8.0 Registers (Continued) 8.5 INTER
Page 423 and 424:
m r--------------------------------
Page 425 and 426:
~ &I) o N m Z ::::: o &I) 'Of' o co
Page 427 and 428:
~ Lt) o N co U) Z ::::: o Lt) '
Page 430 and 431:
4.0 Timing Waveforms (Continued) Re
Page 432 and 433:
6.0 Pin Descriptions (Continued) Re
Page 434 and 435:
8.0 Registers The system programmer
Page 436 and 437:
8.0 Registers (Continued) 8.3 PROGR
Page 438 and 439:
8.0 Registers (Continued) Table II
Page 440 and 441:
9.0 Typical Applications (Continued
Page 442 and 443:
Table of Contents 1.0 ABSOLUTE MAXI
Page 444 and 445:
3.0 AC Electrical Characteristics T
Page 446 and 447:
4.0 Timing Waveforms (Continued) Wr
Page 448 and 449:
,----------------------------------
Page 450 and 451:
5.0 Block Diagram AO A, A2 CSD CSI
Page 452 and 453:
6.0 Pin Descriptions (Continued) tr
Page 454 and 455:
... .I>. '" Bit No. TABLE II. Summa
Page 456 and 457:
8.0 Registers (Continued) 8.3 PROGR
Page 458 and 459:
8.0 Registers (Continued) When the
Page 460 and 461:
'" .j>. 01 PHil This shows the basi
Page 462 and 463:
,----------------------------------
Page 464 and 465:
3. The Rx FIFO will hold 16 bytes r
Page 466 and 467:
NS16550A E-J r-o ..... IRQ4 ICU CPU
Page 468 and 469:
TITLE 550APP.ASM - NS16550A INITIAL
Page 470 and 471: 3.0 Board to Board Communications w
Page 472 and 473: DIAPPS.ASM Flow Chart l> z • ~ CO
Page 474 and 475: » z I "" CD RDAI: DISABLE IRTS, SE
Page 476 and 477: COMPARE: SET UP COMPARE BUffER POIN
Page 478 and 479: .set iCu imsk,lO *aO • set icu -c
Page 480 and 481: holdloop: nop # br hold loop # # #*
Page 482 and 483: # msint: save [rO,rl,r2,r3] # movd
Page 484 and 485: #3/30/B7••••• D2APPS.ASM
Page 486 and 487: # #*************************** 1655
Page 488 and 489: -----------------------------------
Page 490 and 491: A Comparison of the I NS8250, NS 16
Page 492 and 493: -----------------------------------
Page 494 and 495: cessed (see Figure 4), The output o
Page 496 and 497: AC Electrical Characteristics T A =
Page 498 and 499: ~National ~ Semiconductor \ J micro
Page 500 and 501: 1.0 Absolute Maximum Ratings 2.0 Op
Page 502 and 503: 4.0 AC Electrical Characteristics (
Page 504 and 505: 5.0 Timing Waveforms (Continued) ii
Page 506 and 507: -----------------------------------
Page 508 and 509: 6.0 Connection Diagrams Dual-In-Lln
Page 510 and 511: 8.0 Block Diagram CPU INTERFACE INT
Page 512 and 513: 9.0 Registers (Continued) Bit three
Page 514 and 515: .----------------------------------
Page 516: -----------------------------------
Page 519: Section 5 Contents MM74HC942 300 Ba
Page 523 and 524: fj ::z:: ~ :::IE :::IE ~ ,---------
Page 525 and 526: Applications Information (Continued
Page 527 and 528: Absolute Maximum Ratings (Notes 1 &
Page 529 and 530: Description of Pin Functions Pin No
Page 531 and 532: ~ r--------------------------------
Page 533 and 534: ~ r--------------------------------
Page 535 and 536: Electrical Characteristics Unless o
Page 537 and 538: C'I 5 Pin Descriptions (Continued)
Page 539 and 540: IlAV22 RXIN LOCAL OSCILLATOR (L.O.)
Page 541 and 542: Functional Description (Continued)
Page 543 and 544: Functional Description (Continued)
Page 545 and 546: Absolute Maximum Ratings* If Milita
Page 547 and 548: Electrical Characteristics unless o
Page 549 and 550: Functional Description* (Continued)
Page 551 and 552: ,...A212AT RECEIVE FILTER p--------
Page 553 and 554: TABLE III. Remote Digital Loopback
Page 555 and 556: .... ~ ~ U) r----------------------
Page 557 and 558: ..... U) z • U) r----------------
Page 559 and 560: ~ .... ,---------------------------
Page 561 and 562: .,... U) Z 3020 LPRINT USING" 1111
Page 563 and 564: ~ .... r---------------------------
Page 565 and 566: . II) or- II) Z
Page 567 and 568: ,.. i ~~---------------------------
Page 570 and 571:
Section 6 Transmission Line Drivers
Page 572 and 573:
~National ~ Semiconductor Transmiss
Page 574 and 575:
~National ~ Semiconductor OS 1488 Q
Page 576 and 577:
J?'A National ~ Semiconductor OS 14
Page 578 and 579:
~National ~ Semiconductor DS26C31 C
Page 580 and 581:
~National ~ Semiconductor DS26C32C
Page 582 and 583:
~National ~ Semiconductor DS34C86 Q
Page 584 and 585:
~National ~ Semiconductor PRELIMINA
Page 586 and 587:
~National ~ Semiconductor DS1692/DS
Page 588 and 589:
~National ~ Semiconductor DS75150 D
Page 590 and 591:
~National ~ Semiconductor DS75176A/
Page 592 and 593:
-----------------------------------
Page 594 and 595:
~National ~ Semiconductor DS8922/22
Page 596 and 597:
~National ~ Semiconductor DS96172/~
Page 598 and 599:
~National ~ Semiconductor DS961771
Page 600 and 601:
~National ~ Semiconductor DS9637 AI
Page 602 and 603:
• I .----------------------------
Page 604 and 605:
Section 7 Physical Dimensions
Page 606 and 607:
~National ~ Semiconductor All dimen
Page 608 and 609:
NS Package N16A N16A(REV E) 0.092 X
Page 610 and 611:
t-------------I:..':::~"':I'-------
Page 612 and 613:
0.11M-0.118 (2.642-2.9971 .. ••
Page 614 and 615:
NOTES
Page 616 and 617:
~National ~ Semiconductor Bookshelf
Page 618 and 619:
RELIABILITY HANDBOOK-1986 Reliabili
Page 620 and 621:
NATIONAL SEMICONDUCTOR CORPORATION
Page 622 and 623:
NATIONAL SEMICONDUCTOR CORPORATION
Page 624:
~ National ~ Semiconductor
show all

~ National ~ Semiconductor - Al Kossow's Bitsavers

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?