~ National ~ Semiconductor - Al Kossow's Bitsavers

More documents

Recommendations

Info

Absolute Maximum Ratings If Military/Aerospace specified devices are required, VDD to DGND or AGND +7.0V contact the National Semiconductor Sales Office/ Vss to DGND or AGND -7.0V Distributors for availability and specifications. Voltage at Any Input VDD + 0.3Vto Storage Temperature Range Vss - 0.3V Ceramic DIP -65'Cto + 175'C Voltage at Any Digital Output VDD - 0.3Vto Molded DIP and PLCC -65'C to + 150'C DGND - 0.3V Operating Temperature Range O'Cto +70'C Voltage at Any Analog Output VDD + 0.3Vto Lead Temperature Vss - 0.3V Ceramic DIP (soldering, 60 seconds) 300'C Note 1: TJMax ~ 175'C for the Ceramic DIP. 150'C for the Molded DIP and Molded DIP and PLCC PLCC. (soldering 10 seconds) 265'C Note 2: Ratings apply to ambient temperauture at 25'C. Above this tempera- Internal Power Dissipation (Notes 1 and 2) ture, derate the 28L-Ceramic DIP at 16.7 mW/'C, the 28L-Molded DIP at 28L-Ceramic DIP 2.50W 1.92 mW/'C, and the 28L-PLCC at 11.2 mWI'C. 28L-Molded DIP 1.20W 28L-PLCC 1.39W Electrical Characteristics Unless otherwise noted: VDD = 5.0V, VSS = - 5.0V, DGND = AGND = OV, T A = 25'C. All digital signals are referenced to DGND; all analog signals are referenced to AGND. Symbol Parameter Condition Min Typ Max Units ANALOG INTERFACE OUTPUT LEVELS AT TXO: 12000. from TXO to AGND VTXO DATA MODE (Notes 1 and 2) 0.66 0.71 0.76 Vrms Vtonehi DTMF HIGH Group 0.98 1.1 1.22 Vtonelo DTMF LOW Group 0.80 0.9 1.01 Pext Out-of-band energy relative to DTMF output -20 dB Vean Calling Tone 0.65 0.69 0.78 Vrms Vans Answer Tone 0.65 0.69 0.78 VTXSQ Transmitters Squelched 0.3 mVrms VOO Output Offset 5.0 mVde VRXIN Talker Echo + Receiver Signal at RXIN 1.56 Vpeak ZRXIN Input Impedance 100 ko. CLOCK INTERFACE Feloek Clock Frequency 3.6864 MHz Telktol Clock Frequency Tolerance -0.Q1 +0.01 % Vextin External Clock Input HIGH XTL2 driven and 4.5 V Vexl External Clock Input LOW XTL 1 grounded 0.5 V DIGITAL INTERFACE VIL Input Voltage LOW 0.6 V VIH Input Voltage HIGH 2.2 V VOL Output Voltage LOW IL = 1.6mA 0.6 V VOH Output Voltage HIGH IL = -2.0mA 3.0 V ALL DIGITAL INPUTS IlL Input Current LOW DGND ,;: VIN ,;: VIL, -100 /LA IIH Input Current HIGH VIH ,;: VIN ,;: VDD ±50 /LA POWER INTERFACE IDD Supply Current at VDD No Analog Signals 5 8.0 mA Iss Supply Current at Vss -3 -5.0 mA 5-17
Electrical Characteristics Unless otherwise noted: Voo = 5.0V, Vss = -5.0V, DGND = AGND = OV, T A = 25°C. All digital signals are referenced to DGND; all analog signals are referenced to AGND. (Continued) Symbol I Parameter I Condition I Min I Typ I Max I Units ENERGY DETECTOR DATA MODE Vthon OFF/ON Threshold At RXIN 6.5 mVrms Vthoff ON/OFF Threshold 5.2 DATA MODE ton Energy Detect OFF/ON timing AtEDET 105 155 205 ms toff Energy Detect ON/OFF timing 10 17 24 DIALER MODE Vthon OFF/ON Threshold (Dial Tone) At RXIN 10 mVrms Vthon OFF/ON Threshold (Busy, Ringback) 4.6 DIALER MODE Ion Detecting Call Progress Tones AtEDET 19 30 81 ms toff Detecting Call Progress Tones 19 36 81 TRANSMIT (ASYNC/SYNC) AND RECEIVE (SYNCI ASYNC) BUFFERS M Input Character Length Start bit + Data bits + Stop bit 8 11 bits Rtxchar Input Intracharacter Signaling Rate AtTXDpin Basic Signaling Rate Range 1170 1200 1212 bps Extended Signaling Rate Range 1170 1200 1227.6 Lbreak Input Break Sequence Length AtTXDpin M Lbrkaen Transmitted Break Length AtTXOpin 2M + 3 Rrxchar Output Intracharacter Signaling Rate AtRXDpin 1219.05 bps CARRIER FREQUENCIES AND SIGNALING RATES Fcxr(CALL) Carrier Frequency (Calling Mode) CIA = 1 1200 Hz Fcxr(ANS) Carrier Frequency (Answer Mode) CIA = 0 2400 Hz Baud Dibit (Symbol) Rate 600 Baud Fcalltone Calling Tone Frequency TEST = 1, 1301.7 Hz Fanstone Answer Tone Frequency HSKl = HSK2 = 0 2104.1 Fguardlow Low Guard Tone Frequency 548.7 Fguardhigh High Guard Tone Frequency 1800.0 Ftonl DTMF Low Group Frequencies Dialer Mode 698.2 Hz TEST = HSKl = HSK2 = 0 771.9 853.3 942.3 Ftonh DTMF High Group Frequencies Dialer Mode 1209.4 Hz TEST = HSKl = HSK2 = 0 1335.7 1476.9 1634.0 bps Synchronous Data Rate HS = 1 1200 bps HS = 0 600 Tol Tolerance of above frequencies/rates -0.01 +0.01 % Note 1: Output levels vary directly with Voo. Note 2: Guard tone levels, when enabled, are -6 dB (1800 Hz) and -3 dB (550 Hz) with respect to Answer mode data carrier level. When either guard tone is enabled. data carrier level is internally reduced to provide composite output power equal to that of the data carrier with guard tones disabled. See cCirr Recommenda/ion V,22, para. 2.2. bits 5-18
Page 1 and 2:
~ National ~ Semiconductor 400014 R
Page 3 and 4:
TRADEMARKS Following is the most cu
Page 5 and 6:
II) c ~ ~National ~ ~ Semiconductor
Page 7 and 8:
Table of Contents (Continued) Secti
Page 9 and 10:
Alpha-Numeric Index(continUed) DS36
Page 12 and 13:
Section 1 Local Area Networks IEEE
Page 14 and 15:
~National ~ Semiconductor DP8390C/N
Page 16 and 17:
3.0 Functional Description (Continu
Page 18 and 19:
5.0 Pin Descriptions (Continued) BU
Page 20 and 21:
6.0 Direct Memory Access Control (D
Page 22 and 23:
7.0 Packet Reception (Continued) Re
Page 24 and 25:
8.0 Packet Transmission (Continued)
Page 26 and 27:
10.0 Internal Registers (Continued)
Page 28 and 29:
Page 30 and 31:
Page 32 and 33:
Page 34 and 35:
Page 36 and 37:
.----------------------------------
Page 38 and 39:
Page 40 and 41:
12.0 Loopback Diagnostics (Continue
Page 42 and 43:
13.0 Bus Arbitration and Timing The
Page 44 and 45:
13.0 Bus Arbitration and Timing (Co
Page 46 and 47:
Page 48 and 49:
15.0 Switching Characteristics AC S
Page 50 and 51:
15.0 Switching Characteristics (Con
Page 52 and 53:
Page 54 and 55:
Page 56 and 57:
Page 58 and 59:
Page 60 and 61:
Page 62 and 63:
Page 64 and 65:
AC Timing Test Conditions Input Pul
Page 66 and 67:
2.0 Block Diagram COL CRS PROTOCOL
Page 68 and 69:
4.0 Transmit/Receive Packet Encapsu
Page 70 and 71:
5.0 Pin Descriptions (Continued) BU
Page 72 and 73:
7.0 Packet Reception (Continued) fo
Page 74 and 75:
7.0 Packet Reception (Continued) Er
Page 76 and 77:
9.0 Remote DMA The Remote DMA chann
Page 78 and 79:
Page 80 and 81:
Page 82 and 83:
Page 84 and 85:
Page 86 and 87:
Page 88 and 89:
Page 90 and 91:
11.0 Initialization Procedures (Con
Page 92 and 93:
13.0 Bus Arbitration and Timing The
Page 94 and 95:
-----------------------------------
Page 96 and 97:
Page 98 and 99:
15.0 Switching Characteristics AC S
Page 100 and 101:
Page 102 and 103:
Page 104 and 105:
Page 106 and 107:
-----------------------------------
Page 108 and 109:
Page 110 and 111:
Page 112 and 113:
Page 114 and 115:
AC Timing Test Conditions Input Pul
Page 116 and 117:
2.0 Block Diagram TRANSCEIVER CABLE
Page 118 and 119:
PCC Connection Diagram 39.0. 39.0.
Page 120 and 121:
6.0 Absolute Maximum Ratings Recomm
Page 122 and 123:
9.0 Timing and Load Diagrams (Conti
Page 124 and 125:
Page 126 and 127:
2.0 Block Diagram COAX CABLE r ____
Page 128 and 129:
~~L ~------------------------------
Page 130 and 131:
6.0 Absolute Maximum Ratings (Note
Page 132 and 133:
Page 134 and 135:
-----------------------------------
Page 136 and 137:
-----------------------------------
Page 138 and 139:
I: • • • • • • Interrup
Page 140 and 141:
PAL20LB Decode and DMA Interface Lo
Page 142 and 143:
~ U16/8 R1 R1,R2=4.7k.o. Note: For
Page 144 and 145:
Although Cheapernet is intended for
Page 146 and 147:
The transmitted packet from the SNI
Page 148 and 149:
Truth Table for Various Collision D
Page 150 and 151:
CHEAPERNET APPLICATION WITH THE DP8
Page 152 and 153:
DP8390 Network Interface Controller
Page 154 and 155:
ping between the received address a
Page 156 and 157:
If the current local DMA address ev
Page 158 and 159:
6.2 Dual Port Memory One popular me
Page 160 and 161:
StarLAN With The DP839EB Evaluation
Page 162 and 163:
SUPPORTING DOCUMENTS The following
Page 164 and 165:
Pulse Transformer U3 .----. j " "P>
Page 166:
ELECTROSTATIC DISCHARGE TEST (ESD)
Page 169 and 170:
Section 2 Contents DP8340INS32440 I
Page 171 and 172:
.. 0 C'I C") en .... z 0 C") GO Go
Page 173 and 174:
~ 'OIl' N CO) (J) Z .... o 'OIl' CO
Page 175 and 176:
Timing Characteristics Oscillator F
Page 177 and 178:
Timing Waveforms (Continued) TA REG
Page 179 and 180:
.. ... ~ ~National ~ ~ Semiconduc
Page 181 and 182:
Detailed Functional Pin Description
Page 183 and 184:
Message Format (Continued) DATA REC
Page 185 and 186:
Timing Characteristics (Notes 2, 6,
Page 187 and 188:
Timing Waveforms (Continued) 4T±(T
Page 189 and 190:
Typical Applications (Continued) +5
Page 191 and 192:
N r--------------------------------
Page 193 and 194:
~ ..,. r---------------------------
Page 195 and 196:
Timing Characteristics (Continued)
Page 197 and 198:
Functional Timing Waveforms (Contin
Page 199 and 200:
Typical Applications (Continued) DA
Page 201 and 202:
C") "Ot "Ot N C") en ...... z C") "
Page 203 and 204:
) r--------------------------------
Page 205 and 206:
Absolute Maximum Ratings (Note 1) I
Page 207 and 208:
(W) r------------------------------
Page 209 and 210:
M r--------------------------------
Page 211 and 212:
MUX~ __________________ The BIPLAN
Page 213 and 214:
U) ,-------------------------------
Page 215 and 216:
~r---------------------------------
Page 217 and 218:
~ .--------------------------------
Page 219 and 220:
An EPROM implementation was selecte
Page 221 and 222:
MASTER MUL TIPLEXING/DE-MUL TIPLEXI
Page 223 and 224:
AN·496 '" 0, '" (U17/ (U23/6) TO 5
Page 225 and 226:
AN-496 t W19 ~ J2-43 I' [; 0 J2-42
Page 227 and 228:
AN·496
Page 229 and 230:
DP8342/DP8343 HIGH SPEED INTERFACE
Page 231 and 232:
2.0 Connection Diagram A13- 12 A12-
Page 233 and 234:
3.0 Pin Descriptions (Continued) Si
Page 235 and 236:
~ ~ 4.0 Electrical Specifications (
Page 237 and 238:
4.0 Electrical Specifications (Cont
Page 239 and 240:
~ ~ 4.0 Electrical Specifications (
Page 241 and 242:
Page 243 and 244:
c( '
Page 245 and 246:
~L ______________ ___ ~ ~ 4.0 Elect
Page 247 and 248:
Page 249 and 250:
Page 251 and 252:
Page 253 and 254:
Page 255 and 256:
Page 257 and 258:
Page 259 and 260:
5.0 Instruction Set Overview (Conti
Page 261 and 262:
Page 263 and 264:
Page 265 and 266:
Page 267 and 268:
6.0 Instruction Set Reference (Cont
Page 269 and 270:
Page 271 and 272:
~ ,--------------------------------
Page 273 and 274:
Page 275 and 276:
Page 277 and 278:
~ C') 6.0 Instruction Set Reference
Page 279 and 280:
Page 281 and 282:
Page 283 and 284:
Page 285 and 286:
Page 287 and 288:
Page 289 and 290:
Page 291 and 292:
Page 293 and 294:
! 6.0 Instruction Set Reference (Co
Page 295 and 296:
~ ~ 6.0 Instruction Set Reference (
Page 297 and 298:
== ~ 6.0 Instruction Set Reference
Page 299 and 300:
7.0 CPU Registers (Continued) BIT I
Page 301 and 302:
7.0 CPU Registers (Continued) BIRO
Page 303 and 304:
7.0 CPU Registers (Continued) 76543
Page 305 and 306:
7.0 CPU Registers (Continued) BIT D
Page 307 and 308:
7.0 CPU Registers (Continued) BIT D
Page 310 and 311:
8.0 Remote Interface and Arbitratio
Page 312 and 313:
Page 314 and 315:
Page 316 and 317:
Page 318 and 319:
Page 320 and 321:
~ ~ HASM state TCU state eLK-OUT RE
Page 322 and 323:
~I tn tn ...._,__'RS A RS, RSC IMEM
Page 324 and 325:
Page 326 and 327:
~ 01 CO RASM stat. TCU stat. CLK-OU
Page 328 and 329:
~ ~ I\~"'''' I 'ow = "[OW2-0) , RS
Page 330 and 331:
Page 332 and 333:
~ 8l HASM stat. TCU stat. CU- C» b
Page 334 and 335:
.----------------------------------
Page 336 and 337:
10.0 Transceiver (Continued) (a) 32
Page 338 and 339:
10.0 Transceiver (Continued) TABLE
Page 340 and 341:
10.0 Transceiver (Continued) dotted
Page 342 and 343:
10.0 Transceiver (Continued) TABLE
Page 344 and 345:
10.0 Transceiver (Continued) {also
Page 346 and 347:
-----------------------------------
Page 348 and 349:
Decoding Bit Fields with the JRMK I
Page 350 and 351:
Receiver Interrupts/Flags for the D
Page 352 and 353:
****************DA ISR*************
Page 354 and 355:
"Interrupts"-A Powerful Tool of the
Page 356 and 357:
TABLE II. (lCR) Interrupt Mask Bits
Page 358 and 359:
Running the DP8344 with wait states
Page 360 and 361:
» z I U'I Q 01:00 INSTRUCTION ADDR
Page 362 and 363:
WHY EPROM SOFT-LOAD? In a stand-alo
Page 364 and 365:
-----------------------------------
Page 366 and 367:
RESET ~. Timing at Beginning of Ins
Page 368 and 369:
.. I CRYSTAL ~~~.~ I UP TO 64K OP83
Page 370 and 371:
-----------------------------------
Page 372 and 373:
-----------------------------------
Page 374 and 375:
The roll-off frequency, Fro, should
Page 376 and 377:
ceives messages whose first frame a
Page 378 and 379:
RECEIVER INTERRUPT The receiver int
Page 380 and 381:
JMP n LJMP n JMPR Rs JMPI Ptr JRMK
Page 382 and 383:
-----------------------------------
Page 384 and 385:
,----------------------------------
Page 386 and 387:
00044 F90a :J- 226 Z • 227 MOVE A
Page 388 and 389:
l> Z 00074 80BD 2'18 en • 00075 0
Page 390 and 391:
Section 3 ISDN Components
Page 392 and 393:
Introduction To National Semiconduc
Page 394 and 395:
NSC Solutions for Layers 2 and 3 Na
Page 396 and 397:
NSC Solutions: Systems Level Basic
Page 398 and 399:
-----------------------------------
Page 400 and 401:
~National ~ Semiconductor PRELIMINA
Page 402 and 403:
ISDN DEFINITIONS "B" Channel, or DS
Page 404:
~ '" TE2 UP TO 8 TERMINALS -
Page 407 and 408:
Section 4 Contents INS8250/INS8250-
Page 409 and 410:
m . r------------------------------
Page 411 and 412:
3.0 AC Electrical Characteristics T
Page 413 and 414:
. ID
Page 415 and 416:
5.0 Block Diagram INTERNAL DATA IUS
Page 417 and 418:
6.0 Pin Descriptions (Continued) In
Page 419 and 420:
8.0 Registers (Continued) and 1, on
Page 421 and 422:
8.0 Registers (Continued) 8.5 INTER
Page 423 and 424:
m r--------------------------------
Page 425 and 426:
~ &I) o N m Z ::::: o &I) 'Of' o co
Page 427 and 428:
~ Lt) o N co U) Z ::::: o Lt) '
Page 430 and 431:
4.0 Timing Waveforms (Continued) Re
Page 432 and 433:
6.0 Pin Descriptions (Continued) Re
Page 434 and 435:
8.0 Registers The system programmer
Page 436 and 437:
8.0 Registers (Continued) 8.3 PROGR
Page 438 and 439:
8.0 Registers (Continued) Table II
Page 440 and 441:
9.0 Typical Applications (Continued
Page 442 and 443:
Table of Contents 1.0 ABSOLUTE MAXI
Page 444 and 445:
3.0 AC Electrical Characteristics T
Page 446 and 447:
4.0 Timing Waveforms (Continued) Wr
Page 448 and 449:
,----------------------------------
Page 450 and 451:
5.0 Block Diagram AO A, A2 CSD CSI
Page 452 and 453:
6.0 Pin Descriptions (Continued) tr
Page 454 and 455:
... .I>. '" Bit No. TABLE II. Summa
Page 456 and 457:
8.0 Registers (Continued) 8.3 PROGR
Page 458 and 459:
8.0 Registers (Continued) When the
Page 460 and 461:
'" .j>. 01 PHil This shows the basi
Page 462 and 463:
,----------------------------------
Page 464 and 465:
3. The Rx FIFO will hold 16 bytes r
Page 466 and 467:
NS16550A E-J r-o ..... IRQ4 ICU CPU
Page 468 and 469:
TITLE 550APP.ASM - NS16550A INITIAL
Page 470 and 471:
3.0 Board to Board Communications w
Page 472 and 473:
DIAPPS.ASM Flow Chart l> z • ~ CO
Page 474 and 475:
» z I "" CD RDAI: DISABLE IRTS, SE
Page 476 and 477:
COMPARE: SET UP COMPARE BUffER POIN
Page 478 and 479:
.set iCu imsk,lO *aO • set icu -c
Page 480 and 481:
holdloop: nop # br hold loop # # #*
Page 482 and 483:
# msint: save [rO,rl,r2,r3] # movd
Page 484 and 485: #3/30/B7••••• D2APPS.ASM
Page 486 and 487: # #*************************** 1655
Page 488 and 489: -----------------------------------
Page 490 and 491: A Comparison of the I NS8250, NS 16
Page 492 and 493: -----------------------------------
Page 494 and 495: cessed (see Figure 4), The output o
Page 496 and 497: AC Electrical Characteristics T A =
Page 498 and 499: ~National ~ Semiconductor \ J micro
Page 500 and 501: 1.0 Absolute Maximum Ratings 2.0 Op
Page 502 and 503: 4.0 AC Electrical Characteristics (
Page 504 and 505: 5.0 Timing Waveforms (Continued) ii
Page 506 and 507: -----------------------------------
Page 508 and 509: 6.0 Connection Diagrams Dual-In-Lln
Page 510 and 511: 8.0 Block Diagram CPU INTERFACE INT
Page 512 and 513: 9.0 Registers (Continued) Bit three
Page 514 and 515: .----------------------------------
Page 516: -----------------------------------
Page 519 and 520: Section 5 Contents MM74HC942 300 Ba
Page 521 and 522: Absolute Maximum Ratings (Notes 1 &
Page 523 and 524: fj ::z:: ~ :::IE :::IE ~ ,---------
Page 525 and 526: Applications Information (Continued
Page 527 and 528: Absolute Maximum Ratings (Notes 1 &
Page 529 and 530: Description of Pin Functions Pin No
Page 531 and 532: ~ r--------------------------------
Page 533: ~ r--------------------------------
Page 537 and 538: C'I 5 Pin Descriptions (Continued)
Page 539 and 540: IlAV22 RXIN LOCAL OSCILLATOR (L.O.)
Page 541 and 542: Functional Description (Continued)
Page 543 and 544: Functional Description (Continued)
Page 545 and 546: Absolute Maximum Ratings* If Milita
Page 547 and 548: Electrical Characteristics unless o
Page 549 and 550: Functional Description* (Continued)
Page 551 and 552: ,...A212AT RECEIVE FILTER p--------
Page 553 and 554: TABLE III. Remote Digital Loopback
Page 555 and 556: .... ~ ~ U) r----------------------
Page 557 and 558: ..... U) z • U) r----------------
Page 559 and 560: ~ .... ,---------------------------
Page 561 and 562: .,... U) Z 3020 LPRINT USING" 1111
Page 563 and 564: ~ .... r---------------------------
Page 565 and 566: . II) or- II) Z
Page 567 and 568: ,.. i ~~---------------------------
Page 570 and 571: Section 6 Transmission Line Drivers
Page 572 and 573: ~National ~ Semiconductor Transmiss
Page 574 and 575: ~National ~ Semiconductor OS 1488 Q
Page 576 and 577: J?'A National ~ Semiconductor OS 14
Page 578 and 579: ~National ~ Semiconductor DS26C31 C
Page 580 and 581: ~National ~ Semiconductor DS26C32C
Page 582 and 583: ~National ~ Semiconductor DS34C86 Q
Page 584 and 585:
~National ~ Semiconductor PRELIMINA
Page 586 and 587:
~National ~ Semiconductor DS1692/DS
Page 588 and 589:
~National ~ Semiconductor DS75150 D
Page 590 and 591:
~National ~ Semiconductor DS75176A/
Page 592 and 593:
-----------------------------------
Page 594 and 595:
~National ~ Semiconductor DS8922/22
Page 596 and 597:
~National ~ Semiconductor DS96172/~
Page 598 and 599:
~National ~ Semiconductor DS961771
Page 600 and 601:
~National ~ Semiconductor DS9637 AI
Page 602 and 603:
• I .----------------------------
Page 604 and 605:
Section 7 Physical Dimensions
Page 606 and 607:
~National ~ Semiconductor All dimen
Page 608 and 609:
NS Package N16A N16A(REV E) 0.092 X
Page 610 and 611:
t-------------I:..':::~"':I'-------
Page 612 and 613:
0.11M-0.118 (2.642-2.9971 .. ••
Page 614 and 615:
NOTES
Page 616 and 617:
~National ~ Semiconductor Bookshelf
Page 618 and 619:
RELIABILITY HANDBOOK-1986 Reliabili
Page 620 and 621:
NATIONAL SEMICONDUCTOR CORPORATION
Page 622 and 623:
NATIONAL SEMICONDUCTOR CORPORATION
Page 624:
~ National ~ Semiconductor
show all

~ National ~ Semiconductor - Al Kossow's Bitsavers

Create successful ePaper yourself

Delete template?

Save as template?