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Molecular beam epitaxial growth of III-V semiconductor ... - KOBRA

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Introduction<br />

thesis a detailed study <strong>of</strong> the <strong>growth</strong> and characterization <strong>of</strong> InAs and InGaAs<br />

QDs embedded in Si matrix as well as in GaAs matrix will be presented. The<br />

careful optimization <strong>of</strong> dierent <strong>growth</strong> parameters led to controlled QDs formation<br />

in density, shape and size. Generally, this thesis deals with main aspects<br />

<strong>of</strong> the current understanding <strong>of</strong> the fundamental physical mechanisms that control<br />

the <strong>epitaxial</strong> formation <strong>of</strong> <strong>III</strong>-V nanostructures (quantm dots and dashes) on<br />

Si substrates and presents the basic investigations for improving the structural<br />

characteristics <strong>of</strong> such heterostructures (HSs).<br />

1.1 Monolithic Integration <strong>of</strong> <strong>III</strong>-V Semiconductor<br />

on Silicon<br />

The most convincing approach for a low-cost mass production <strong>of</strong> optoelectronic<br />

devices is the monolithic integration <strong>of</strong> <strong>III</strong>-V heterostructures with silicon microelectronics,<br />

which in turns employ the direct <strong>epitaxial</strong> <strong>growth</strong> <strong>of</strong> <strong>III</strong>-V <strong>semiconductor</strong><br />

compounds layers on the Si wafers.<br />

1.1.1 Status <strong>of</strong> Current Research and Challenges<br />

Growth <strong>of</strong> <strong>III</strong>-V materials on silicon results in highly strained <strong>III</strong>-V lms due to<br />

the large lattice and thermal mismatch between the lm and the substrate. The<br />

system <strong>of</strong> InAs QDs embedded in silicon matrix has been under investigations<br />

over the past decade [3, 4]. At a substrate temperature <strong>of</strong> 370 ◦ C, the formation<br />

<strong>of</strong> InAs QDs were observed by RHEED at an InAs coverage <strong>of</strong> 1.7 MLs and independent<br />

<strong>of</strong> the As/In ux ratios [3]. In addition, the thermal mismatch caused<br />

by the dierent thermal expansion coecients <strong>of</strong> <strong>III</strong>-V lm and substrate, results<br />

in an additional strain by cooling down the material from <strong>growth</strong> to room temperature.<br />

Typical values for the thermal expansion coecients for InAs and Si<br />

are 4.52 × 10 −6 k −1 and 2.6 × 10 −6 k −1 , respectively [5]. Introduction <strong>of</strong> mismatch<br />

dislocations in the strained lm relieves lattice strain at layer thicknesses<br />

above the critical thickness <strong>of</strong> the materials. It was also experimentally observed,<br />

2

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