Molecular beam epitaxial growth of III-V semiconductor ... - KOBRA
Molecular beam epitaxial growth of III-V semiconductor ... - KOBRA
Molecular beam epitaxial growth of III-V semiconductor ... - KOBRA
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5.3 Results and Discussion<br />
25-32 nm (Fig. 5.3(b),(c)) and a signicant enhancement <strong>of</strong> the homogeneity <strong>of</strong><br />
the dot distributions.<br />
5.3.3 InAs Quantum Dots Grown on Silicon Buer Layer<br />
The inuence <strong>of</strong> the <strong>growth</strong> parameters on the structural properties (size, density<br />
and shape) <strong>of</strong> InAs QDs like In-<strong>growth</strong> rate, V/<strong>III</strong> ratio, <strong>growth</strong> temperature and<br />
InAs coverage, were investigated using the following conditions: Ga treatment for<br />
2 min (0.1 ML/s) at 560 ◦ C, thermal desorption at 870 ◦ C for 15 min, 50 nm<br />
Si buer grown at 700 ◦ C, 10 min post <strong>growth</strong> annealing (PGA) at 800 ◦ C on<br />
n-doped Si (100) substrate have been performed for all the samples before InAs<br />
deposition for additional crystallinity improvement. The <strong>growth</strong> conditions used<br />
here are: V/<strong>III</strong> ratio 25, <strong>growth</strong> temperature at 400 ◦ C, Indium (In) <strong>growth</strong> rate<br />
= 108 nm/h, 2 MLs InAs coverage and only one <strong>growth</strong> parameter was changed<br />
(see subsections below).<br />
5.3.3.1 Homoepitaxy <strong>of</strong> Silicon Buer Layer<br />
After in-situ (thermal desorption at 870 ◦ C for 15 min.) and ex-situ (wet etching<br />
using buered HF) surface treatment <strong>of</strong> Si substrate, a silicon buer layer<br />
was grown. The electron <strong>beam</strong> evaporator cell in MBE Gen II was calibrated<br />
using two samples. In order to calculate the real <strong>growth</strong> rate <strong>of</strong> the (EBE) cell<br />
at given emission current I emission and voltage V . Two samples with dierent<br />
thicknesses <strong>of</strong> 50 and 100 nm, respectively were grown according to deposition<br />
controller measurements (quartz crystal sensor). However, at the same time the<br />
preparation time for each sample was recorded. The real thickness <strong>of</strong> each sample<br />
was measured via prolometer. From thickness measurements, the tooling factor<br />
was extracted using Eq. 5.6.<br />
T ooling factor =<br />
T hickness pr<strong>of</strong>ilometer(real)<br />
× 100 (5.6)<br />
T hickness deposition controller<br />
This tooling factor value (correction factor) was inserted later in the s<strong>of</strong>tware<br />
<strong>of</strong> the deposition controller to read the real deposition rate <strong>of</strong> the silicon cell. The<br />
<strong>growth</strong> parameters which were used for the calibration are; I emission = 72 mA, V<br />
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