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Molecular beam epitaxial growth of III-V semiconductor ... - KOBRA

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Hetero<strong>epitaxial</strong> Growth <strong>of</strong> <strong>III</strong>-V Semiconductor on Silicon Substrates<br />

3.2.2 Basics Physical Processes in MBE<br />

Understanding kinetics, thermodynamics and how they interact and compete<br />

with each other would enable us to know how to control the <strong>growth</strong> <strong>of</strong> thin lm,<br />

which is <strong>of</strong> great important to all modern <strong>semiconductor</strong> technologies. However,<br />

in MBE <strong>growth</strong>, the <strong>beam</strong>s from dierent sources intersect each other at the substrate<br />

surface, where the crystallization processes take place. A series <strong>of</strong> surface<br />

processes take place during MBE <strong>growth</strong> which are schematically summarized in<br />

Fig. 3.1. The surface processes occurring during MBE <strong>growth</strong> are characterized<br />

by a set <strong>of</strong> relevant kinetic parameters that describe them quantitatively. The<br />

arrival rate is described by the ux <strong>of</strong> the arriving species and gives the number<br />

<strong>of</strong> atoms impinging on the unit area <strong>of</strong> the surface per second. Evaporated<br />

atoms with temperature T i onto substrate surface, which has temperature T s ,<br />

usually lower than T i at dierent positions are with dierent kinetics energies.<br />

Depending on the atom energy and the position at which it hits the substrate<br />

surface, the impinging atom could re-evaporate immediately, carrying with it an<br />

energy corresponding to temperature T e or exchange energy with atoms <strong>of</strong> the<br />

substrate at T s . A description <strong>of</strong> this process is possible by dening the thermal<br />

accommodation coecient (α)as [33]:<br />

α = T i − T e<br />

T i − T s<br />

(3.1)<br />

When T e equal to T s the accommodation coecient is unity. Thus, it is<br />

emerges as a measure <strong>of</strong> the extent to which the arriving atoms reach thermal<br />

equilibrium with the substrate. It is important to distinguish between the accommodation<br />

coecient (α) and the sticking coecient (S c ). The sticking coecient<br />

is dened as the ratio <strong>of</strong> the number <strong>of</strong> atoms adsorb (N ads ) or stick to the substrate<br />

surface, to the total number <strong>of</strong> atoms (N tot ) that impinge upon substrate<br />

surface during the same period <strong>of</strong> time, and mathematically expressed as below<br />

[33]:<br />

S c = N ads<br />

N tot<br />

(3.2)<br />

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