Handbook of air conditioning and refrigeration / Shan K

30.24 CHAPTER THIRTY
Design Considerations
REFERENCES
During the selection of AHUs, if the fan performance of the AHU is expressed in volume flow V˙
versus fan total pressure �pt, the designer should ascertain that the pressure drops of the loaded filters
are included in �pt, not those of the clean ones.
The successful construction of a class 1, 10, or 100 clean room depends on the combined effort of
architects, mechanical engineers, production engineers, owners, contractors, HVAC&R equipment
manufacturers, and many others. To maintain a temperature tolerance of � 0.1°F (0.056°C) for a
manufacturing process, it is important to stabilize all internal loads during the processing period.
The process should be surrounded by conditioned space for which the tolerance is � 0.5°F
(0.3°C). Even movement of production personnel toward the processing area may cause radiant
heat turbulence and temperature fluctuations.
Energy use per ft 2 (m 2 ) floor area of a clean-room system for class 1 through class 100 clean
rooms is 5 to 10 times higher than that of an air conditioning system for a commercial building.
Careful analyses and improvements based on experience with similar projects will provide a satisfactory
indoor environment for the manufacturing process and also will reduce the energy use of the
clean-room system. Semiconductor products that are being produced now may become obsolete
within a few years. As with many other HVAC&R systems, air conditioning system design for clean
rooms must incorporate flexibility for change and future development.
ASHRAE, ASHRAE Handbook 1996, HVAC Systems and Equipment, ASHRAE Inc., Atlanta, GA, 1996.
ASHRAE, ASHRAE Handbook 1999, HVAC Applications, Atlanta, GA, 1999.
ASHRAE, ASHRAE/IESNA Standard 90.1-1999, Energy Standard for Buildings Except New Low-Rise
Residential Buildings, Atlanta, GA, 1999.
Atkinson, G. V., and G. R. Martino, Control of Semiconductor Manufacturing Cleanrooms, ASHRAE
Transactions, 1989, Part I, pp. 477–482.
Austin, S. B., HVAC System Trend Analysis, ASHRAE Journal, no. 2, 1997, pp. 44–50.
Baylie, C. L., and S. H. Schultz, Manage Change: Planning for the Validation of HVAC Systems for a Clinical
Trials Production Facility, ASHRAE Transactions, 1994, Part I, pp. 1660–1668.
Garr, H. B., Clean Room Humidity Control, Heating/Piping/Air Conditioning, no. 3, 1992, pp. 67–70.
Hunt, E., D. E. Benson, and L. G. Hopkins, Fan Efficiency vs. Unit Efficiency for Cleanroom Application,
ASHRAE Transactions, 1990, Part II, pp. 616–619.
Linford, R. G., and S. T. Taylor, HVAC Systems: Central vs. Floor-by-Floor, Heating/Piping/Air Conditioning,
no. 7, 1989, pp. 43–58.
Mandelbaum, I., HVAC Modifications for Semiconductor Fabrication, Heating/Piping/Air Conditioning, no. 3,
1991, pp. 29–32.
Naughton, P., HVAC Systems for Semiconductor Cleanrooms—Part 1: System Components, ASHRAE
Transactions, 1990a, Part II, pp. 620–625.
Naughton, P., HVAC Systems for Semiconductor Cleanrooms—Part 2: Total System Dynamics, ASHRAE
Transactions, 1990b, Part II, pp. 626–633.
Ottmer, J. H., Central Plant Cools and Heats World’s Largest Airport, Heating/Piping/Air Conditioning, no. 5,
1994, pp. 43–47.
Rose, T. H., Noise and Vibration in Semiconductor Clean Rooms, ASHRAE Transactions, 1986, Part I B,
pp. 289–298.
Schneider, R. K., How to Design a Cleanroom, Engineered Systems, no. 3, 1996, pp. 58–62.