II - DCE FEL ČVUT v Praze

Wiring diagram
SM 33 1
AI 8 xTC / 4 x RTD
+ input 0/0
- input 0/0
+ input 1/-
- input 1/-
+ input 2/2
- input 2/2
+ input 3/-
- input 3/-
+ input 4/4
- input 4/4
+ input 5/-
- input 5/-
+ input 6/6
- input 6/6
+ input 7/-
- input 7/-
X 2
3 4
331-7SF00-0AB0
I/O Modules with Intrinsically-Safe Signals
C79000-G7076-C152-04
x
SF
F0
F1
F2
F3
[EEx ib] IIC
F4
F5
F6
F7
Fig. 3-16 shows the module view and the terminal diagram of the SM 331;
AI 8 x TC/4 x RTD
You will find detailed technical specifications of the analog input module
SM 331; AI 8 x TC/4 x RTD on the following pages.
5V internal
M internal
Isolation
Logic and
backplane bus
interfacing
Isolation
SF
Internal
supply
Internal
compensation
F (0...7)
ADU
Power
source
SF group fault indication [red]
Channel-specific fault indication [red]
F (0...7) [TC], F (0,2,4,6) [RTD]
Optomultiplexer
Fig. 3-16 Module view and block diagram of SM 331; AI 8 x TC/4 x RTD
Notes on
intrinsically-safe
installation
SIMATIC S7 Ex Analog Modules
Thermocouples, voltage
measurement
M0 +
M0 CH0
M1 +
M1 CH1
M2 +
M2 CH2
M3 +
M3 CH3
M 4 +
M4 M5 +
M5 M6 +
M6
M7 +
M7 Resistance
measurement
CH4
CH5
CH6
CH7
M 0 +
M0 IC0 +
IC0 M1 +
M1 IC1 +
IC1 M 2 +
M2 IC2 +
IC2 M3 +
M3 IC3 +
IC3 CH0
CH2
CH4
CH6
You must connect the DM 370 dummy module between the CPU or IM 153-2
(in a distributed configuration) and the Ex I/O modules whose signal cables
lead into the hazardous location. In a distributed configuration with an active
backplane bus, you should use the ex dividing panel/ ex barrier instead of the
dummy module. Additional information on system design can be found in
Sections 1.3 - 1.5.
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