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II - DCE FEL ČVUT v Praze

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Shielding of<br />

intrinsically safe<br />

signal lines<br />

Grounding system<br />

of intrinsically safe<br />

circuits<br />

Mechanical Configuration of an Automation System with SIMATIC S7 Ex Modules<br />

I/O Modules with Intrinsically-Safe Signals<br />

C79000-G7076-C152-04<br />

In Section 5.3.3, DIN VDE 0165 stipulates general equipotential bonding in<br />

hazardous areas to avoid different potentials and sparking as a result.<br />

Equipotential bonding must be rated and implemented as laid down in DIN<br />

VDE 0100.<br />

In accordance with DIN VDE 0165, Section 6.1.3.3, intrinsically safe circuits<br />

are generally not grounded. However, they must be grounded if required for<br />

safety reasons. They also may be grounded if required for functional reasons.<br />

Grounding may only take place at one point by connection to the equipotential<br />

bonding conductor.<br />

Intrinsically safe signal lines and cables are shielded for measurement<br />

reasons and in order to avoid inductive coupling as, in most cases, no signal<br />

level is applied.<br />

The following procedure must be implemented in the planning of the<br />

equipotential bonding with intrinsically safe signal lines:<br />

– Metallic housings whose mounting arrangement provide reliable<br />

contact to structural components do not require a separate ground as<br />

they are incorporated in the equipotential bonding arrangement of the<br />

system.<br />

– The shielding is grounded at only one point in order to avoid looping.<br />

This is implemented for systems of Zone 1, 2 and 11 outside the<br />

hazardous area, preferably in the control room.<br />

The shield must be insulated at the device in the hazardous zone. The<br />

measured value is routed via a twisted pair signal line (single cable) to a<br />

distribution board and via a multiple cable to the control room. The shield is<br />

insulated at all intermediate points.<br />

In zone 0, the shield is connected directly at the apparatus adapter box<br />

(mostly zone 1) to the general equipotential bonding system. The apparatus is<br />

grounded directly via the ground conductor.<br />

1-29

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