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Online proceedings - EDA Publishing Association

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11-13<br />

<br />

May 2011, Aix-en-Provence, France<br />

<br />

Design Number<br />

Fig. 9. Design number versus applied resonant frequency<br />

mode of the structure, modal analysis was performed. Thirty<br />

modes were simulated for six different volume of<br />

piezoelectric energy harvester. The mode with the highest<br />

displacement was identified as mode of interest [3].<br />

A range of 230 Hz to 1.5 kHz resonant frequency for five<br />

different designs is simulated to get maximum power output<br />

at the ambient resonant frequency. Fig. 10 shows the effect of<br />

resonance frequency to the output power produced. The<br />

lower the resonant frequency, the higher the output power<br />

produced. The highest output power is 3.056 W at 232 Hz<br />

resonant frequency. The power output produced is enough to<br />

power the wireless condition monitoring circuits since power<br />

plants generate ambient vibrations at low frequencies.<br />

C. The effect of chosen piezoelectric material on output<br />

power.<br />

MEMS technology has introduced the concept of<br />

many functional materials with new fabrication process<br />

which allow a creation of miniature devices consuming less<br />

power, reliable and integrate multiple functions. One of the<br />

main functional materials is piezoelectric thin film.<br />

Piezoelectric materials develop charge on the sample surfaces<br />

when exposed to applied stresses or vibration. [6].<br />

The choice of the piezoelectric thin films depends<br />

on the process complexity, piezoelectric coupling coefficient<br />

and CMOS compatibility. The most common materials used<br />

are aluminium nitride (AlN), zinc oxide (ZnO) and lead<br />

zicronate titanate (PZT). PZT provides highest coupling<br />

coefficient. However, PZT thin film deposition is very<br />

complex and hazardous due to lead contamination. AlN and<br />

ZnO are both wurtzite structure materials with the polar<br />

direction [6]. Low deposition temperature is kept during<br />

sputtering process to obtain high quality of piezoelectric AlN<br />

and ZnO films and to allow complete integration capabilities<br />

with CMOS technology [6]. The low deposition temperature<br />

also offers the use of standard Al for metallization layers<br />

(electrodes). The sputter deposition techniques for both AlN<br />

and ZnO is also well-known standard deposition and is less<br />

complex compared to the deposition of PZT. Therefore, the<br />

simulations are shown to discuss the effect of AlN and ZnO<br />

piezoelectric materials only.<br />

Fig. 10. Output power produced versus applied resonant frequency<br />

The main material properties for the analysis are<br />

piezoelectric strain coefficient; dielectric constant and<br />

stiffness matrix. The material properties for ZnO and AlN<br />

piezoelectric material are summarized in Table IV and Table<br />

V [5] [7]. The Dielectric entries shown are relative values to<br />

vacuum permittivity 0 = 8.85 x 10 -12 c/(vm) [5].<br />

The aim of the simulation analysis is to compare the<br />

output power produced at the resonance frequency for two<br />

different piezoelectric material used: AlN and ZnO. Table<br />

VII and Fig. 11 show that zinc oxide provides more energy<br />

output compared to aluminium Nitride (AlN). At 242 Hz<br />

resonant frequency, the peak power output produced for ZnO<br />

is 3.0560 µW and 0.8000 µW for AlN for the same volume<br />

TABLE IV<br />

ZINC OXIDE AND ALUMINUM NITRIDE PIEZOELECTRIC PROPERTIES<br />

Parameter ZnO AlN<br />

Density ( kg/m 3 ) 5.8 e -13 3.2 e -15<br />

Coupling Coefficient, k 0.33 0.24<br />

Relative dielectric<br />

constant, <br />

10.9 10.5<br />

TABLE V<br />

ELASTIC CONSTANTS FOR ZINC OXIDE , [C ZnO] 6X6 AND ALUMINUM NITRIDE , [C AIN] 6X6<br />

C COLUMN X ROW ZnO (N/m 2 ) AlN (N/m 2 )<br />

C 11 2.907 x 10 5 3.450 x 10 5<br />

C 21 1.21 x 10 5 1.250 x 10 5<br />

C 22 2.907 x 10 5 3.450 x 10 5<br />

C 31 1.051 x 10 5 1.200 x 10 5<br />

C 32 1.051 x 10 5 1.200 x 10 5<br />

C 33 2.109 x 10 5 3.950 x 10 5<br />

C 44 4.430 x 10 4 1.100 x 10 5<br />

C 55 4.240 x 10 4 1.180 x 10 5<br />

C 66 4.240 x 10 4 1.180 x 10 5<br />

TABLE VI<br />

PIEZOELECTRIC STRAIN COUPLING MATRIX COEFFICIENT FOR ZINC OXIDE , [dZnO] 3X6<br />

AND ALUMINUM NITRIDE , [d AIN] 3X6<br />

Parameters ZnO (C/m 2 ) AlN (C/m 2 )<br />

d 31 -5.430 x 10 -6 -5.800 x 10 -1<br />

d 33 1.167 x 10 -5 1.55<br />

d 15 1.134 x 10 -5 4.800 x 10 -1<br />

- d 15 -1.134 x 10 -5 -4.800 x 10 -1<br />

88

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