Online proceedings - EDA Publishing Association
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Fig. 6. Block diagram of the feedback loop.<br />
Synoptic view is resumed in Fig. 7 with the complete<br />
block diagram of the closed-loop system. Abbreviations<br />
mentioned are the ones used in Fig. 4 and Fig. 6.<br />
Henceforth, output voltage is a function of the electrical<br />
power required to maintain a zero temperature difference<br />
between the two detectors.<br />
Fig. 7. Block diagram of the closed-loop system.<br />
With this closed-loop configuration, we perform a<br />
frequency analysis, visible in Fig. 8, of the accelerometer<br />
presented in section 2. A sensitivity S 1 = 76 mV/g or<br />
0.034 °C/g closed to the open-loop configuration one is<br />
obtained while the cut-off frequency has increased by more<br />
than a factor 15 with a value F c = 1025 Hz. In this case, a<br />
resonance appears that would disappear with better settings<br />
on the PID controller. Nevertheless, this bandwidth result is<br />
the larger never obtained with a thermal accelerometer. It is<br />
ten times larger that could be found in the literature.<br />
Fig. 8. Closed-loop frequency response.<br />
11-13 <br />
May 2011, Aix-en-Provence, France<br />
<br />
V. CONCLUSION<br />
This work investigates the behavior improvement<br />
brought by a closed-loop configuration when using a<br />
MEMS thermal accelerometer. This sensor was<br />
micromachined by micro-electronics techniques. In a first<br />
time, we studied the open-loop configuration with typical<br />
characteristics. A closed-loop structure has been conceived<br />
to improve bandwidth with no sensitivity reduction.<br />
Feedback loop is directly included in this sensor<br />
architecture by addition of two resistors close to detectors.<br />
Modulation of the electrical power injected allows<br />
temperature profile to remain symmetric. Experimental<br />
measures prove that we can achieve a large bandwidth for a<br />
system based on thermal exchanges with no modification<br />
of thermal sensitivity.<br />
REFERENCES<br />
[1] J. Fraden, Handbook of Modern Sensors. Woodbury, New York:<br />
American Institute of Physics, 1998.<br />
[2] A.M. Leung, J. Jones, E. Czyzewska, J. Chen and B. Woods,<br />
“Micromachined accelerometer with no proof mass,” Digest Tech.<br />
Papers International Electron Devices Meeting, Conference,<br />
Washington, DC, USA, December 7–10, 1997, pp. 899–902.<br />
[3] X.B. Luo, Y.J. Yang, F. Zheng, Z.X. Li and Z.Y. Guo, “An<br />
optimized micromachined convective accelerometer with no proof<br />
mass,” J Micromech Microeng, vol. 11, no. 5, pp. 504–8, 2001.<br />
[4] F. Mailly, A. Martinez, A. Giani, F. Pascal-Delannoy and A.<br />
Boyer “Effect of gas pressure on the sensitivity of a<br />
micromachined thermal accelerometer,” Sensor Actuat A-Phys,<br />
vol. 109, pp. 88–94, 2003.<br />
[5] J. Courteaud, P. Combette, N. Crespy, G. Cathebras and A. Giani,<br />
“Thermal simulation and experimental results of a micromachined<br />
thermal inclinometer,” Sensor Actuat A-Phys, vol. 141, pp. 307–<br />
313, 2008.<br />
[6] A. Garraud, P. Combette, F. Pichot, J. Courteaud, B. Charlot and<br />
A. Giani, “Frequency response analysis of an accelerometer based<br />
on thermal convection,” J. Micromech Microeng, 21 (2011)<br />
035017.<br />
[7] J. Courteaud, N. Crespy, P. Combette, B. Sorli and A. Giani,<br />
“Studies and optimization of the frequency response of a<br />
micromachined thermal accelerometer,” Sensor Actuat A-Phys,<br />
vol. 147, pp. 75–82, 2008.<br />
[8] P. Temple-Boyer, C. Rossi, E. Saint-Etienne and E. Scheid,<br />
“Residual stress in low pressure chemical vapor deposition SiNx<br />
films deposited from silane and ammonia,” J Vac Sci Technol A,<br />
vol. 16, no. 4, pp. 2003-2007, 1998.<br />
[9] O. Leman, L. Latorre, F. Mailly and P. Nouet, “A Closed-Loop<br />
Architecture with Digital Output for Convective Accelerometers,”<br />
Proceedings of IEEE Computer Society Annual Symposium on<br />
VLSI, Montpellier, France, April 07-09, 2008, pp. 51-56.<br />
[10] J. Dido, P. Loisel, A. Renault, P. Combette, J. Courteaud and A.<br />
Giani, "Thermal cell system for measuring acceleration", United<br />
States Patent 7469587, to Sagem Defense Securite (Paris, FR),<br />
2008.<br />
[11] C. Gervais, A. Renault, B. Varusio, A. Boyer and A. Giani,<br />
“Thermal measure of acceleration, speed, position or inclination<br />
uses a predetermined volume of heated fluid, compensates for<br />
reduction in temperature due to acceleration by using auxiliary<br />
heaters”, FR2832802 - 2003-05-30<br />
136