Online proceedings - EDA Publishing Association

Figure 10: The images of without and with repaired
TFT-LCD using proposed experimental results of laser
repairing processes
IV. CONCLUSION
A linear energy compensation method was investigated
and designed by using a measurement of laser energy output
that provides a stable linear energy laser for processes. In the
method, the laser energy testing only requires a fixed time for
measuring laser energy and changing laser energy compensate
table. Furthermore, the laser equipment doses not need stop
during the laser power meter calibration. In addition, a software
method for linear energy compensation was designed and
applied to the laser equipments which have no laser power
meter compensation practices. The method could control and
compensate laser energy in linear output which the energy
linear proportion (R square) reaches 0.9989 and provided a very
stable power source. When using this laser method in the LCD
panel design processes, the successes rate reached 80% in
performing the bright pixel repair. In panel defect repair, it
could prevent taking the case apart from module and fabricate
that increases the efficiency in production.
ACKNOWLEDGMENT
The authors are grateful to the assistance from both
engineers in Shuz Tung Machinery Industrial CO. LTD,
Taiwan and AU Optronics Corp. Taiwan.
REFERENCES
[1] C. Jeong,Y.Jinwoo,P. G. Poo ―A defect inspection method for TFT
panel using the compute unified device architecture (CUDA)‖,
Industrial Electronics, 2009. ISIE 2009. IEEE International
Symposium on, (2009) p779-782.
[2] W. C. Lee ,J. B. Song , B. Y. Kim, S. H. Park, S. M. Lim, W. J.
Lee―Auto Defect Repair Algorithm For LCD Panel Review &
Repair Machine‖, SICE Annual Conference, 2008 , p2200-2203.
[3] J. Lee, J. Ehrmann, D. Smart, J. Griffiths, J. Bernstein, ―Analyzing
11-13
May 2011, Aix-en-Provence, France
the Process Window for Laser Copper-link Processing,‖ Solid State
Technology,(2002) p63-66.
[4] J. B. Bernstein, J. Lee, G. Yang, T. Dahmas, ―Analysis of Laser
Metal-cut Energy Process Window,‖ IEEE Semicondut. Manufact.,
Vol. 13, No. 2,(2000) p228-234.
[5] K.J. Chung,‖ Microbridge Formation for Low Resistance Interline
Connection Using Pulsed Laser Techniques‖ Doctor of Philosophy,
2005.
[6] G. Chryssolouris, Laser Machining—Theory and Practice.
Mechanical Engineering Series, Springer-Verlag, New York Inc.,
NewYork,(1991).
[7] J.D. Majumdar, I. Manna, Laser processing of materials,
Sadhana 28 (3–4) (2003) p495–562.
[8] T. Norikazu, Y. Shigenori, H. Masao, Present and future of lasers for
fine cutting of metal plate, Journal of Materials Processing
Technology 62 (1996) p309–314
[9] C. H. Li, M. J. Tsai, R. Chen, C. H. Lee, S. W. Hong, Cutting for QFN
packaging by diode pumping solid state laser system, Proceedings of
IEEE Workshop on Semiconductor Manufacturing Technology
(2004) p123–126.
[10] C. H. Li, M. J. Tsai, S. M. Yao, Cutting quality study for QFN
packages by Nd:YAG laser, Proceedings of the IEEE International
conference on Mechatronics (ICM’05) (2005) p19–24.
[11] C.-H. Li, M.-J. Tsai, C.-D. Yang, Study of optimal laser parameters
for cutting QFN packages by Taguchi’s matrix method, Optics and
Laser Technology 39, (2007) p786–795.
[12] J.K.S. Sundar, S.V. Joshi, Laser cutting of materials, Centre for Laser
Processing of Materials, International Advance Research Centre for
Powder Metallurgy and New Materials, Hyderabad.
[13] A. K. Dubey a and V. Yadava, Laser beam machining—A review,
International Journal of Machine Tools and Manufacture, Vol 48,
Issue 6, (2008) p609-628
[14] D. K. Y. Low, L. Li, P. J. Byrd, The influence of temporal pulse train
modulation during laser percussion drilling, Optics and Lasers in
Engineering 35:149-164,2001
333