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Online proceedings - EDA Publishing Association

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(BNCD) as the active microelectrode material, our approach is<br />

based on a bottom-up patterning process [12], fully compatible<br />

with standard clean room fabrication methods.<br />

In this process, see Figure 1, the wafer (typically oxidised<br />

silicon) undergoes at first a nano-seeding operation on its<br />

entire surface by spreading a colloidal solution of diamond<br />

nano-particles in suspension in ethanol (example of nanoparticle<br />

solution: provided by SP3 SEKI Technotron). Then, a<br />

protective sacrificial metal layer is used as hard mask to<br />

protect the nano-particles while the unprotected regions are<br />

etched away using an oxygen/argon plasma RIE step.<br />

This step required technological optimization and results are<br />

reported in figure 2. One can see that after 10 minutes of<br />

plasma exposure, the crystal density decreases below 10 6 cm -2 ,<br />

and after 20 minutes duration of the plasma exposure, the<br />

changes in crystal density becomes non significant, which<br />

corresponds to the end of this etching phase. Indeed all<br />

diamond nano-particles originating from the nano-seeding<br />

have been etched away and the residual density is mainly due<br />

to surface defects, the nano-seeding density remaining above<br />

10 10 cm -2 on non etched surfaces while reaching only 5.10 5<br />

cm -2 on etched surfaces.<br />

Finally, the protective metal layer is completely removed<br />

considering that it is not affecting significantly the nanopowders<br />

immobilized onto the substrate surface. One<br />

difficulty here was the control of the uniformity of the nanoparticle<br />

distribution.<br />

The final step is the local growth of diamond on pre-defined<br />

patterned electrodes.<br />

11-13 <br />

May 2011, Aix-en-Provence, France<br />

<br />

Residual density (cm -2 )<br />

1,0E+09<br />

1,0E+08<br />

1,0E+07<br />

1,0E+06<br />

1,0E+05<br />

1,0E+04<br />

0 5 10 15 20 25<br />

Plasma etching duration (min)<br />

Figure 2. Residual nucleation density of diamond nanoparticles<br />

versus plasma etching duration.<br />

III.<br />

MEA FABRICATION AND CHARACTERISATIONS<br />

The technological fabrication route for MEAs implies a<br />

similar process as the one described in part II. MEAs can be<br />

done either with (i) the local growth of diamond on existing<br />

metal electrodes (Titanium) and using Si 3 N 4 for insulation, or<br />

(ii) with the homogeneous growth of diamond followed by the<br />

definition of annular metallic contacts. The top side<br />

passivation is ensured using SU8. Both solutions have been<br />

tested, see Figure 3.<br />

i)<br />

ii)<br />

Figure 3. Diamond based MEA using the process i) or ii).<br />

Figure 1. Diamond based Microelectrode fabrication process.<br />

Fabricated MEAs are characterised using electrochemical<br />

measurements in ferri/ferrocyanide 1mM (cyclic voltametry<br />

and Electrochemistry Impedance Spectrocscopy (EIS)) and<br />

their performances are compared with that of Pt identical<br />

devices.<br />

In-vitro B-NCD MEAs were tested with retina of rat, i.e. (i)<br />

cultures of ganglion cells (CGC) and spinal cords, i.e. (ii)<br />

organotypic cultures of mouse spinal cords. The tests<br />

demonstrated that no difference could be observed with<br />

respect to glass control, see Figure 4. Also, no proteinic<br />

coating was found to be necessary to ensure cell growth.<br />

379

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