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Online proceedings - EDA Publishing Association

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high-sensitivity piezoelectric microelectromechanical systems<br />

accelerometers, Journal of Microelectromechanical Systems, 2003, 12,<br />

4: 433-439.<br />

[4] Kunz K, Enoksson P, Stemme G: Highly sensitive triaxial silicon<br />

accelerometer with integrated PZT thin film detectors. Sensors and<br />

actuators A, 2001; 92: 156-160.<br />

[5] Hindrichsen C.C., Almind N.S., Brodersen S.H., Hansen O., and<br />

Thomsen E.V.: Analytial model of a PZT thick-film triaxial<br />

acceleromter for optimum design, IEEE Sensor Journal, 2009, 9, 4:<br />

419-429.<br />

[6] Zhu M, Kirby P, Lim MY: Lagrange’s formalism for modeling of a<br />

triaxial microaccelerometer with piezoelectric thin-film sensing,<br />

Sensors Journal, IEEE, 2004; 4, 4: 455 – 463.<br />

[7] Van Kampen RP, Woffenbuttel RF: Modeling the mechanical behavior<br />

of bulk-micromachined silicon accelerometers. Sensors and actuators A,<br />

1998; 64: 137-150.<br />

[8] Gere J. M., Timoshenko S. P. (1997) Mechanics of Materials, 4 th ed.,<br />

PWS <strong>Publishing</strong> Company, Boston, MA..<br />

[9] Yu J., Lee C., Chang C., Kuo W., Chang C.: Modeling Analysis of a<br />

Tri-Axial Microaccelerometer with Piezoelectric Thin-Film Sensing<br />

11-13 <br />

May 2011, Aix-en-Provence, France<br />

<br />

Using Energy Method, paper accepted, to appear in Journal of<br />

Microsystem Technologies.<br />

[10] Thomson W. T. and Dahleh M. D., Theory of vibration with application,<br />

5th ed., Prentice-Hall, New Jersey, 1998.: 23<br />

[11] Lang W.: Silicon Microstructuring Technology, Materials Science and<br />

Engineering: R: Reports, 1996 , 17, 1: 1-55.<br />

Brief biography of the corresponding author:<br />

Jyh-Cheng Yu graduated from the National Taiwan University,<br />

ROC, in 1985, and received the M.S. and Ph.D. degrees from<br />

the Department of Mechanical Engineering, the Ohio State<br />

University, USA. He now serves as a professor in the<br />

Department of Mechanical and Automation Engineering at<br />

the National Kaohsiung First University of Science and<br />

Technology. His research interests include design and<br />

manufacturing of piezoelectric microsensors, LCD back light<br />

module, and engineering optimization.<br />

Structure Stiffness<br />

Mass /<br />

Moment of Inertia<br />

Open Circuit<br />

<br />

s<br />

Sensitivity EI<br />

<br />

S<br />

<br />

Table 6. Summary of modeling parameters for the tri-axial acceleration sensing<br />

Symmetric<br />

Asymmetric<br />

Torsional<br />

Mode<br />

Mode<br />

Mode<br />

48EI<br />

<br />

2<br />

2<br />

3<br />

Y eq<br />

<br />

ll )463 12<br />

bb mme llE EIY<br />

eq<br />

qY<br />

( 2 )(<br />

I<br />

K s <br />

bbt<br />

Gtwc<br />

3<br />

Ka<br />

<br />

K<br />

<br />

3<br />

ts<br />

<br />

ww<br />

bm<br />

4 <br />

3<br />

l<br />

l<br />

l<br />

l<br />

b<br />

m t,s = m s +4m eq,s<br />

tlEdm<br />

tP<br />

<br />

12<br />

a<br />

Sa<br />

<br />

2 <br />

b<br />

4<br />

JJJ<br />

ya 0,<br />

ae t<br />

q<br />

<br />

<br />

lltEdzm<br />

t <br />

b<br />

xt 0,<br />

te t<br />

q<br />

b<br />

4<br />

JJJ<br />

3 P 1, b Ps t<br />

3 1,,<br />

bmp p<br />

pa 3 c p 1,,<br />

pb t<br />

<br />

2 a<br />

2<br />

S<br />

<br />

t<br />

<br />

Y eq 33<br />

lK 2<br />

ba <br />

a<br />

wE I<br />

33<br />

mY 33<br />

<br />

<br />

tEdlzm<br />

<br />

<br />

2)<br />

<br />

96

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