Online proceedings - EDA Publishing Association

More documents

Recommendations

Info

Presently, the microfabrication processes we use are the liftoff process (LOR 3B + Shipley 1813) for the deposition of the interference filter and the utilization of a hard-mask for delimitation of the photodetector active region, combined with plasma O 2 for stripping the absorbance component. III. TESTS AND RESULTS A. Optical filter tests For the optical filter measurements, the stop-band attenuation is evaluated at the excitation wavelength of 532 nm while the pass-band attenuation is evaluated at emission wavelengths above 650 nm. With the E-Beam evaporation manufacturing process, the interference filter has an attenuation of -12.6 dB at 532 nm and -0.76 dB at 650 nm. Absorbing filter attenuation is -32.6 dB at 532 nm and -1.28 dB at 650 nm. The combination of these two filter types gives a rejection of 43 dB between the excitation and the emission bands. This spectral rejection remains practically constant over angular incidences ranging from 0 to 60 degrees (Fig. 4). To improve the fabrication reproducibility of the interference filter via a better control over film thickness, we moved from E-Beam evaporation to RF-sputtering. With this technique, the interference filters have a measured rejection of 16 dB – nearly identical to the previous fabrication process with E-Beam evaporation. Combined with absorbing component, the total rejection is 47dB. B. BQJ detector and signal processing At the BQJ detector’s outputs, reverse bias setting and photocurrent measurements were performed using a probing station. The photocurrent of each junction were calculated from I ph,i = I i – I dark,i , where I dark,i was measured in dark conditions (I dark,i = 1.04 pA, 0.86 pA, 2.22 pA, 9.29 pA, for i = 1 to 4, at room temperature). Fig. 5a shows the measured spectral responses of the BQJ detector prior to filter deposition. To eliminate fluctuations in the response due to mutual interference from the reflections at the dielectric interfaces and power variations of the optical source, the normalization ( N ~ i ( ) ) of BQJ responses are used according to the following definition: 11-13 May 2011, Aix-en-Provence, France ~ S , ( ) i ( ) I phi Ni ( ) with i = 1, ... 4 (1) 4 4 S j I ph, j j1 j1 where I ph is the photocurrent of each junction. Fig. 5b shows the normalized responses of the BQJ detector for a wavelength range between 450 nm and 700 nm, showing the desired smooth curves. For each specific wavelength, the graphs on Fig. 5b show the contribution of each junction relative to the sum of the photocurrents. Using the BQJ detector for multi-tag fluorescence applications, up to four-tag contributions can be determined. To evaluate this capacity of spectral discrimination, a multiple-LED source with peak emission wavelengths respectively at λ 1 = 463nm, λ 2 = 575nm, λ 3 = 625nm, λ 4 = 655nm) was used to simulate a multi-tag fluorescencelike mixture: λ 1 , λ 1 + λ 2 , λ 1 + λ 3 , …. Using a vectorial analysis (calculation of an error vector in 4-dimensional space), multi-wavelength test optical inputs were correctly identified in twelve situations over the fifteen possibilities. Identification errors are due to the fact that two LEDs have very close emission wavelengths (λ 3 and λ 4 ). This spectral proximity caused an ill-conditioned problem in the vectorial analysis, to be avoided. (a) Fig. 4 Performance of the hybrid filter as a function of illumination angle. (b) Fig. 5 (a) Spectral response of BQJ detector (b) Normalization of BQJ outputs (Reverse bias: 1.5 V for each junction). 302
The transmittance of the filter deposited onto a BDJ detector can be obtained by calculating the logarithmic ratio of the measured photocurrents before and after filter deposition (Fig. 6). We validated this measurement method by comparing results from an on-chip integrated interference filter with another filter deposited on a reference glass substrate (Eagle XG) in the same fabrication process. The measured attenuation of the interference filters was -12.0 dB and -12.6 dB, respectively. The transmittance was evaluated by monitoring the photocurrents from the two photodiodes. The transmittance of the hybrid filter compared to a reference glass substrate shows a potential of total rejection near 50 dB from 532 nm (reject band) to 650 nm (passband). However, measurements for the same filter deposited on the detector were close to the noise floor of our SMU (HP4142B, Agilent, USA). For this reason, the photocurrent at 532 nm (illumination with a frequencydoubled YAG laser) was obtained using the on-chip integrated charge amplifier coupled with the integration time method [12]. The attenuation of the hybrid filter deposited on a BDJ detector was evaluated to be -60 dB at 532 nm, compared to -50 dB for the reference case with filter deposition on a glass substrate. The difference between the two cases may be due to a mismatch of deposited absorbing filter thickness. In the packaged die, the thickness is probably greater larger than that of the reference due to the non-ideal spin-coating and the presence of more pronounced edgebead. The main characteristics of the BQJ detector and the on-chip integrated filters are summarized in Table I. IV. CONCLUSION We have proposed a hybrid interference-absorbing filter with optimized performance (for normal incidence and offaxis illumination) for fluorescence detection requiring high excitation rejection and minimal autofluorescence. The rejection reaches -60 dB between 532nm to 650nm. Fig. 6 Attenuation of the interference filter over the BDJ photodetector 11-13 May 2011, Aix-en-Provence, France Photodetector Interference filter Absorbing filter Hybrid filter TABLE I MAIN RESULTS 0.8μm Multi-HighVoltage CMOS/DMOS DALSA Type : Buried Quad pn-Junction (BQJ) Active area: 200 x 200 µm² (shallow-junction) Total area: 420 x 420 µm 2 Dark currents @ room temperature I 1=1.04 pA, I 2=0.86 pA, I 3=2.22 pA, I 4=9.29 pA 9 thin-film layers (TiO 2/SiO 2) Thickness: ~ 1.2 µm Manufacturing process : E-Beam evaporation -12.6 dB @ 532 nm (stop-band) -0.76 dB @ 650 nm (pass-band) Manufacturing process : RF sputtering -16.6 dB @ 532 nm (stop-band) -0.5 dB @ 650 nm (pass-band) KMPR photoresist + Orasol Red Thickness: ~ 1.6 µm Manufacturing process : spin-coating -32.6 dB @ 532 nm (stop-band) -1.28 dB @ 650 nm (pass-band) Rejection between the excitation and the emission bands: 43 dB for E-Beam evaporation process 47 dB for RF sputtering process The developed fabrication process is compatible with CMOS integration. Its on-chip integration with a CMOS BQJ detector allows determination of multi-labeling spectral contributions (up to 4 tags). ACKNOWLEDGMENTS This work was supported in part by grants from the Natural Sciences and Engineering Research Council of Canada (NSERC), Nano-Québec, and Teledyne-DALSA. The collaborative work was supported by the Laboratoire International Associé en Nanotechnologies et Nanosystèmes (LIA-LN2). REFERENCES [1] M. Dandin, P. Abshire, and E. Smela, "Optical filtering technologies for integrated fluorescence sensors," Lab on a Chip, vol. 7, pp. 955-77, 2007/08/ 2007. [2] G. T. Roman and R. T. Kennedy, "Fully integrated microfluidic separations systems for biochemical analysis," Journal of Chromatography A, vol. 1168, pp. 170-188, Oct 19 2007. [3] R. Bashir, "BioMEMS: State-of-the-art in detection, opportunities and prospects," Advanced Drug Delivery Reviews, vol. 56, pp. 1565-1586, 2004. [4] P. Pittet, J. M. Galvan, G. N. Lu, L. J. Blum, and B. D. Leca- Bouvier, "CMOS LIF detection system for capillary analysis," Sensors and Actuators B (Chemical), vol. B97, pp. 355-61, 2004. [5] K.-S. Shin, Y.-H. Kim, J.-A. Min, S.-M. Kwak, S. K. Kim, E. G. Yang, J.-H. Park, B.-K. Ju, T.-S. Kim, and J. Y. Kang, "Miniaturized fluorescence detection chip for capillary electrophoresis immunoassay of agricultural herbicide atrazine," Instrumental Methods of Analysis - IMA 2005, Analytica Chimica Acta, vol. 573-574, pp. 164-171, 2006. 303
Page 2 and 3:
COLLECTION OF PAPERS PRESENTED AT T
Page 4 and 5:
III
Page 6 and 7:
V
Page 8 and 9:
Table of Contents Wednesday 11 May
Page 10 and 11:
PANEL DISCUSSION TEXTILE MICROSYSTE
Page 12 and 13:
Friday 13 May SESSION C4: APPLICATI
Page 14 and 15:
SPECIAL SESSION OF BIO-MEMS/NEMS a
Page 16 and 17:
11-13 May 2011, Aix-en-Provence, Fr
Page 18 and 19:
11-13 May 2011, Aix-en-Provence, F
Page 20 and 21:
Page 22 and 23:
Page 24 and 25:
suspended membrane can be pulled to
Page 26 and 27:
most likely due to not yet consider
Page 28 and 29:
Page 30 and 31:
that detectors may measure the diff
Page 32 and 33:
2) Cavity width effect To verify th
Page 34 and 35:
Page 36 and 37:
Fig.9. Capacitive sensor output, Va
Page 38 and 39:
11-13 May, 2011, Aix-en-Provence,
Page 40 and 41:
The anode and cathode are connected
Page 42 and 43:
11-13 May , 2011 , Aix-en-Provence,
Page 44 and 45:
Page 46 and 47:
Page 48 and 49:
Page 50 and 51:
! 11-13 May 2011, Aix-en-Provence,
Page 52 and 53:
! 11-13 May 2011, Aix-en-Provence,
Page 54 and 55:
! TABLE 3 SUMMARY OF SELECTIVITIES
Page 56 and 57:
Page 58 and 59:
Page 60 and 61:
Page 62 and 63:
The fabrication of optical Cap-Wafe
Page 64 and 65:
the glass is polished down in a cos
Page 66 and 67:
Page 68 and 69:
Page 70 and 71:
Page 72 and 73:
Fig. 14. Time history of the envelo
Page 74 and 75:
Page 76 and 77:
Page 78 and 79:
We have reported that how base mode
Page 80 and 81:
We assume that 11-13 May 2011, Aix
Page 82 and 83:
Page 84 and 85:
Y X Fig. 1. Scanning electron mic
Page 86 and 87:
10 3 11-13 May 2011, Aix-en-Proven
Page 88 and 89:
Intenstiy (counts/second) Fig. 1. X
Page 90 and 91:
Page 92 and 93:
Page 94 and 95:
etween x 2 to L (remember that x 2
Page 96 and 97:
Page 98 and 99:
Page 100 and 101:
Page 102 and 103:
Page 104 and 105:
Page 106 and 107:
piezoelectric displacement transduc
Page 108 and 109:
Figure 7 Displacement conditions of
Page 110 and 111:
protect the corners from undercut.
Page 112 and 113:
Page 114 and 115:
A. Continuous domain Starting from
Page 116 and 117:
Fig. 8. Central finite difference m
Page 118 and 119:
Page 120 and 121:
700 11-13 May 2011, Aix-en-Provenc
Page 122 and 123:
o o o o o o o o Check applicability
Page 124 and 125:
C. Identification Results The ident
Page 126 and 127:
The proposed solution for this prob
Page 128 and 129:
teen wire segments of a coil, as in
Page 130 and 131:
As the metallization is too reflect
Page 132 and 133:
B. Implemented die overview A die c
Page 134 and 135:
Page 136 and 137:
IN CLK OUT Fig. 16. Probe setup for
Page 138 and 139:
Page 140 and 141:
adhesive material with 30μm thickn
Page 142 and 143:
Page 144 and 145:
Page 146 and 147:
B. Dynamics of Energy Flows For a l
Page 148 and 149:
Page 150 and 151:
Page 152 and 153:
11-13 May, Aix-en-Provence, France
Page 154 and 155:
80˚C. Additionally, we looked into
Page 156 and 157:
The XRD shows a peak above the 2θ
Page 158 and 159:
fibers which define the electric co
Page 160 and 161:
Page 162 and 163:
Figure 15. Key board input system.
Page 164 and 165:
ρ = h 2∆α∆T + + E 1h 3 1 +E 2
Page 166 and 167:
Page 168 and 169:
In recent years, the pipe flow moni
Page 170 and 171:
As the speed of the rotor increases
Page 172 and 173:
Page 174 and 175:
Page 176 and 177:
inches silicon wafers which have th
Page 178 and 179:
samples tested in different vacuum
Page 180 and 181:
l c 11-13 May 2011, Aix-en-Provence
Page 182 and 183:
Vp (V) 3,5 3,0 2,5 2,0 1,5 1,0 0,5
Page 184 and 185:
Page 186 and 187:
II. MATHEMATICAL MODEL AND NUMERICA
Page 188 and 189:
fluids travel along a curved channe
Page 190 and 191:
measured mixing indices are depicte
Page 192 and 193:
length, which enables them to focus
Page 194 and 195:
Page 196 and 197:
however, a rotation for coincidence
Page 198 and 199:
Page 200 and 201:
Page 202 and 203:
Page 204 and 205:
excludes the nature of the fixed bo
Page 206 and 207:
Using the radial and tangential mid
Page 208 and 209:
Page 210 and 211:
Page 212 and 213:
Page 214 and 215:
Page 216 and 217:
Now the challenge in data handling
Page 218 and 219:
value of every active channel. Ther
Page 220 and 221:
Page 222 and 223:
Page 224 and 225:
Page 226 and 227:
Page 228 and 229:
Page 230 and 231:
electrocardiogram. • The heart be
Page 232 and 233:
Page 234 and 235:
In our work, we proposed an innovat
Page 236 and 237:
Fig. 8 Concept of the in-home perso
Page 238 and 239:
found that the early-stage diagnosi
Page 240 and 241:
Page 242 and 243:
Page 244 and 245:
Power monitoring data detected by w
Page 246 and 247:
Page 248 and 249:
device consisted of a bimorph canti
Page 250 and 251:
where C others is the capacitance o
Page 252 and 253:
Page 254 and 255:
Page 256 and 257:
Page 258 and 259:
operation, the pressure inside the
Page 260 and 261:
Page 262 and 263:
increased. 11-13 May 2011, Aix-en-
Page 264 and 265: 11-13 May 2011, Aix-en-Provence, F
Page 266 and 267: coefficient compatible with the mic
Page 270 and 271: Variable Description Value Crab-leg
Page 276 and 277: Membrane weight (mg) Fig. 4. Struct
Page 282 and 283: So far, the expected major contribu
Page 284 and 285: al. used a modified LIGA (German ac
Page 292 and 293: REFERENCES [1] G. Mehta, J. Lee, W.
Page 296 and 297: followed by titanium (Ti) which sho
Page 298 and 299: exposure dose, post exposure bake t
Page 300 and 301: #### ##/&### 3 # #
Page 302 and 303: *5%6,+/.,-,7-, ,+.,1/21* %
Page 304 and 305: B. Energy Applications Society is f
Page 306 and 307: 11-13 May 2011, Aix-en-Provence, Fr
Page 316 and 317: [6] C. Richard, A. Renaudin, V. Aim
Page 318 and 319: NA sinθ c 11-13 May 2011, Aix-en-
Page 320 and 321: the waveguide on the fused silica,
Page 322 and 323: microphone diaphragm. The chosen CM
Page 326 and 327: TABLE V MICROPHONE CHARACTERISTICS
Page 330 and 331: Figure 7b shows the effect of a par
Page 334 and 335: over the temperature range (i.e. th
Page 340 and 341: given. This allows a CTM model to b
Page 348 and 349: the magic-Tee, and the coherent sig
Page 352 and 353: After analyzing the two conditions
Page 354 and 355: IV. MICRO FABRICATION For fabricati
Page 358 and 359: IV. A. Simulation and Sensitivity A
Page 364 and 365:
Page 366 and 367:
grown to sub-confluence were washed
Page 368 and 369:
Page 370 and 371:
Clamps rotation [21] Clamps transla
Page 372 and 373:
Layout Total dimensions of the grip
Page 374 and 375:
Page 376 and 377:
focusing increased both as the stre
Page 378 and 379:
Page 380 and 381:
Time of diffusion (hr) 1200 1000 80
Page 382 and 383:
Page 384 and 385:
Page 386 and 387:
Chip Magnet Light source Hot plate
Page 388 and 389:
above, they would move to upward an
Page 390 and 391:
Page 392 and 393:
Page 394 and 395:
Page 396 and 397:
Page 398 and 399:
Page 400 and 401:
This phenomenon is now reaching the
Page 402 and 403:
C. Proof mass displacement Moreover
Page 404 and 405:
Page 406 and 407:
Page 408 and 409:
The VerilogA block code is : 11-13
Page 410 and 411:
Author Index Abi-Saab D. 81 Aimez V
Page 412:
Nussbaum Dominic 273 O’Hara T. 35
show all

Online proceedings - EDA Publishing Association

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?