Bulletin 2009/49 - European Patent Office
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Bulletin 2009/49 - European Patent Office

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(B23Q) I.1(2)<br />

(51) B23Q 16/10 (11) 2 127 804 A1<br />

B23Q 1/28 B23Q 1/70<br />

(25) Ja (26) En<br />

(21) 07831625.4 (22) 12.11.2007<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HU IE IS IT LI LT LU LV MC MT NL PL PT<br />

RO SE SI SK TR<br />

(86) JP 2007/071895 12.11.2007<br />

(87) WO 2008/087785 2008/30 24.07.2008<br />

(30) 15.01.2007 JP 2007005276<br />

(54) • SCHALTVORRICHTUNG FÜR WERKZEUG-<br />

MASCHINEN<br />

• INDEXING DEVICE FOR MACHINE TOOLS<br />

• DISPOSITIF D'INDEXAGE POUR MACHI-<br />

NES-OUTILS<br />

(71) Tsudakoma Kogyo Kabushikikaisha, 18-18,<br />

Nomachi 5-chome, Kanazawa-shi, Ishikawa<br />

921-8650, JP<br />

(72) TATSUDA, Yoshinori, Ishikawa 921-8650, JP<br />

NISHIDA, Youichi, Ishikawa 921-8650, JP<br />

(74) Samson & Partner, Widenmayerstrasse 5,<br />

80538 München, DE<br />

B23Q 17/00 → (51) G01N 21/47<br />

B23Q 17/09 → (51) B23B 47/18<br />

B23Q 17/24 → (51) G01N 21/47<br />

B24B 7/06 → (51) B24B 7/28<br />

(51) B24B 7/18 (11) 2 127 805 A1<br />

B24D 13/14 B24B 57/02<br />

A47L 11/283<br />

(25) En (26) En<br />

(21) 08157014.5 (22) 27.05.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(54) • Verfahren und System zur Erhaltung von<br />

Hartbodenflächen<br />

• Method and system for maintaining hard<br />

floor surfaces<br />

• Procédé et système pour l'entretien de<br />

surfaces dures de plancher<br />

(71) HTC SWEDEN AB, BOX 69, 614 22 Söderköping,<br />

SE<br />

(72) Thysell, Håkan, 614 34 Söderköping, SE<br />

(74) Bokinge, Ole, Awapatent AB Junkersgatan 1,<br />

582 35 Linköping, SE<br />

(51) B24B 7/22 (11) 2 127 806 A2<br />

B24B 37/04 H01L 21/304<br />

(25) En (26) En<br />

(21) 09161073.3 (22) 26.05.<strong>2009</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK TR<br />

(30) 28.05.2008 JP 2008140018<br />

(54) • Verfahren zum Abschleifen von Halbleiter-<br />

Wafern, Abschleifsplatte und Abschleifungsvorrichtung<br />

• Method of grinding semiconductor wafers,<br />

grinding surface plate, and grinding device<br />

• Procédé de rodage de tranches semiconductrices,<br />

plaque de rodage et dispositif<br />

de rodage<br />

(71) SUMCO CORPORATION, 2-1, Shibaura 1chome<br />

Minato-ku, Tokyo 105-8634, JP<br />

(72) Hashii, Tomohiro, Minato-ku Tokyo 105-<br />

8634, JP<br />

Yamada, Yasunori, Minato-ku Tokyo 105-<br />

8634, JP<br />

Kakizono, Yuichi, Minato-ku Tokyo 105-<br />

8634, JP<br />

(74) Polypatent, An den Gärten 7, 51<strong>49</strong>1 Overath,<br />

DE<br />

Europäisches <strong>Patent</strong>blatt<br />

<strong>European</strong> <strong>Patent</strong> <strong>Bulletin</strong><br />

<strong>Bulletin</strong> européen des brevets<br />

(51) B24B 7/28 (11) 2 127 807 A2<br />

B24B 7/06<br />

(25) It (26) En<br />

(21) 09161004.8 (22) 25.05.<strong>2009</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK TR<br />

(30) 26.05.2008 IT UD20080120<br />

(54) • Endbearbeitungsmaschine und Verfahren<br />

für Abschnitte aus Holz- oder Holzersatzmaterial<br />

• Finishing machine and method for sections<br />

made of wood or wood substitute material<br />

• Machine de finition et procédé de sections<br />

fabriquées à base de bois ou matériau de<br />

substitut de bois<br />

(71) DELLE VEDOVE LEVIGATRICI SpA, Viale<br />

Treviso 13a, I-33170 Pordenone, IT<br />

(72) Delle Vedove, Gaetano, 33170 Pordenone, IT<br />

(74) Petraz, Gilberto Luigi, et al, GLP S.r.l.<br />

Piazzale Cavedalis 6/2, 33100 Udine, IT<br />

B24B 13/06 → (51) B23C 3/16<br />

(51) B24B 23/03 (11) 2 127 808 A1<br />

B24B 41/00<br />

(25) En (26) En<br />

(21) 08157146.5 (22) 29.05.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(54) • Elektrowerkzeug<br />

• Power tool<br />

• Outil électrique<br />

(71) Black & Decker, Inc., 1207 Drummond Plaza,<br />

Newark, DE 19711, US<br />

(72) Walker, Andrew, Newton Hall, Durham DH1<br />

5XF, GB<br />

McKay, Timothy, Ashington, Northumberland<br />

NE63 9EJ, GB<br />

(74) Bell, Ian Stephen, et al, Black & Decker<br />

<strong>Patent</strong> Department 210 Bath Road, Slough<br />

Berkshire SL1 3YD, GB<br />

(51) B24B 31/14 (11) 2 127 809 A1<br />

(25) It (26) En<br />

(21) 09159801.1 (22) 08.05.<strong>2009</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK TR<br />

(30) 26.05.2008 IT MI20080973<br />

(54) • Vorgeformtes Schleifelement<br />

• A preshaped abrasive element<br />

• Élément abrasif préformé<br />

(71) Redaelli, Paolo, 1/9 Via Marina, 20050<br />

Lesmo (Milano), IT<br />

(72) Redaelli, Paolo, 20050 Lesmo (Milano), IT<br />

(74) Corradini, Corrado, et al, Ing. C. CORRADINI<br />

& C. S.r.l. Via Dante Alighieri 4, 42100<br />

Reggio Emilia, IT<br />

B24B 37/00 → (51) H01L 21/304<br />

(51) B24B 37/04 (11) 2 127 810 A1<br />

(25) En (26) En<br />

(21) 09161077.4 (22) 26.05.<strong>2009</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK TR<br />

(30) 28.05.2008 JP 2008139963<br />

(54) • Verfahren und Vorrichtung zum beidseitigen<br />

Polieren von Halbleiterscheiben<br />

• Method and device for grinding both<br />

surfaces of semiconductor wafers<br />

• Procédé et dispositif de polissage des deux<br />

faces de tranches semi-conductrices<br />

448<br />

Anmeldungen<br />

Applications<br />

Demandes (<strong>49</strong>/<strong>2009</strong>) 02.12.<strong>2009</strong><br />

(71) SUMCO CORPORATION, 2-1, Shibaura 1chome<br />

Minato-ku, Tokyo 105-8634, JP<br />

(72) Yamada, Yasunori, Minato-ku Tokyo Tokyo<br />

105-8634 , JP<br />

Takaishi, Kazushige, Minato-ku Tokyo Tokyo<br />

105-8634 , JP<br />

Kakizono, Yuichi, Minato-ku Tokyo Tokyo<br />

105-8634, JP<br />

(74) Polypatent, An den Gärten 7, 51<strong>49</strong>1 Overath,<br />

DE<br />

B24B 37/04 → (51) B24B 7/22<br />

B24B 41/00 → (51) B24B 23/03<br />

B24B 55/10 → (51) B23Q 11/00<br />

B24B 57/02 → (51) B24B 7/18<br />

B24D 3/10 → (51) C22C 26/00<br />

B24D 13/14 → (51) B24B 7/18<br />

B25B 11/00 → (51) B23K 37/04<br />

(51) B25B 21/00 (11) 2 127 811 A1<br />

B25F 5/00 F16D 41/20<br />

(25) En (26) En<br />

(21) 09006714.1 (22) 19.05.<strong>2009</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK TR<br />

(30) 27.05.2008 JP 2008138430<br />

27.05.2008 JP 2008138431<br />

(54) • Schraubendreher<br />

• Screw driver<br />

• Tournevis<br />

(71) Hitachi Koki CO., LTD., 15-1, Konan 2-chome<br />

Minato-ku, Tokyo 108-6020, JP<br />

(72) Satou, Shinichirou, Hitachinaka-shi Ibaraki<br />

312-8502, JP<br />

Yamada, Hideki, Hitachinaka-shi Ibaraki 312-<br />

8502, JP<br />

Suzuura, Tsukasa, Hitachinaka-shi Ibaraki<br />

312-8502, JP<br />

(74) Strehl Schübel-Hopf & Partner, Maximilianstrasse<br />

54, 80538 München, DE<br />

B25B 21/00 → (51) B25B 23/14<br />

B25B 21/00 → (51) B25F 5/00<br />

(51) B25B 23/14 (11) 2 127 812 A1<br />

B25B 21/00 G01L 5/24<br />

(25) Ja (26) En<br />

(21) 08703974.9 (22) 28.01.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

(86) JP 2008/051165 28.01.2008<br />

(87) WO 2008/093625 2008/32 07.08.2008<br />

(30) 29.01.2007 JP 2007017482<br />

(54) • VORRICHTUNG ZUR DETEKTION EINES<br />

LASTMOMENTES AN EINEM ELEKTRO-<br />

MOTOR<br />

• DEVICE FOR DETECTING LOAD TORQUE<br />

ON ELECTRIC MOTOR<br />

• PROCÉDÉ DE DÉTECTION D'UN COUPLE<br />

DE CHARGE SUR UN MOTEUR ÉLEC-<br />

TRIQUE<br />

(71) Totsu, Katsuyuki, 32-13, Oshiage 1-chome<br />

Sumida-ku, Tokyo 131-0045, JP<br />

(72) Totsu, Katsuyuki, Tokyo 131-0045, JP<br />

(74) HOFFMANN EITLE, <strong>Patent</strong>- und Rechtsanwälte<br />

Arabellastrasse 4, 81925 München, DE<br />

B25B 23/151 → (51) G05D 17/00

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